Used Bonder
334 resultsSold in working condition Vintages 2009~2013 Year(s) : 2009, 2013 Location : EUROPE (Western and Northern)
Price : On request
More detailsDouble Cabin Machine type one Controller. Year(s) : 2005 Location : EUROPE (Western and Northern)
Price : On request
More detailsWire bonder Vintage : 2006/7 units,2005/4 units Condition : Off line Year(s) : 2005, 2006 Location : EUROPE (Western and Northern)
Price : On request
More details- Software Version: on request - Operating System: on request - Condition: Refurbished - Wafer Mapping: Year(s) : 2016 Location : EUROPE (Western and Northern)
Price : On request
More details• H14 Zoom Stereo-Microscope Nikon SMZ 460 60x • H24 Adjustable Work Stage 90 mm low profile for part heigh Location : EUROPE (Western and Northern)
Price : On request
More detailsEVG 510 Wafer Bonder consisting of: - Model: 510 Wafer Bonder - Manual wafer load substrate bonder - Ca Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsAccessories Monitors Condition Good Year of Manufacture 2018 Year(s) : 2018 Location : EUROPE (Western and Northern)
Price : On request
More detailsAccessories Monitors Condition Good Year of Manufacture 2017 Year(s) : 2017 Location : EUROPE (Western and Northern)
Price : On request
More detailsAccessories Monitors Condition Good Year(s) : 2016 Location : EUROPE (Western and Northern)
Price : On request
More detailsDIE ATTACH ESEC_2100HS Accessories Monitors Condition Good Year of Manufacture 2016 Year(s) : 2016 Location : EUROPE (Western and Northern)
Price : On request
More detailsESEC DIE ATTACH ESEC_2100HS Accessories Monitors Condition Good Year of Manufacture 2017 Year(s) : 2017 Location : EUROPE (Western and Northern)
Price : On request
More detailsThe machine was only used very rarely for small quantities. Tool condition very good, fully functional When w Year(s) : 2000 Location : EUROPE (Western and Northern)
Price : On request
More detailsTDK AFM-15 Flip Chip Bonder Machine is in excellent condition It was only used in R& D Year(s) : 2009 Location : EUROPE (Western and Northern)
Price : On request
More detailsF&K Delvotek 6200 Gold Ball Wire Bonder System w/ Leica MZ6 Head Vertical Feed, Deep Access Gold Ball Bonder Location : EUROPE (Western and Northern)
Price : On request
More detailsESEC DIE ATTACH ESEC_2100HS Accessories Monitors Condition Good Year(s) : 2017 Location : EUROPE (Western and Northern)
Price : On request
More detailsThis system is equipped with handlers but was being used in a manual / prototype fashion previously. Unit is Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsCondition: Like new, as it's only used for R&D for a WLCSP Year(s) : 2012 Location : EUROPE (Western and Northern)
Price : On request
More detailsAccessories Monitors Condition Good Automatic Epoxy Die Bonders Year(s) : 2018 Location : EUROPE (Western and Northern)
Price : On request
More detailsDie Bonder Model AD838L Location : EUROPE (Western and Northern)
Price : On request
More detailsgood condition Year(s) : 2005 Location : EUROPE (Western and Northern)
Price : On request
More detailsWire Bonder 45° Bondhead Vintage 2014 an be inspected and tested at site in Switzerland Year(s) : 2014 Location : EUROPE (Western and Northern)
Price : On request
More detailsIncluded 3 monitors Condition Good Year(s) : 2004 Location : EUROPE (Western and Northern)
Price : On request
More detailsCondition Refurbished Heated bondhead Wafer strecher Flip unit Tool bank Year(s) : 2012 Location : EUROPE (Western and Northern)
Price : On request
More detailsAccessories 3 monitors Condition Good Year of Manufacture 2008 Year(s) : 2008 Location : EUROPE (Western and Northern)
Price : On request
More detailsWIRE BONDER Accessories Monitors Year of Manufacture 2003 Condition Good Year(s) : 2003 Location : EUROPE (Western and Northern)
Price : On request
More detailsYou can find used Bonder on Wotol
The main manufacturers of Bonder are Esec, ASM, West Bond, K & S, Kulicke and Soffa (K&S), EVG, Orthodyne, KNS, Westbond, Alphasem, Dage, Delvotec, Mech-El, Hesse, Alessi , Benchmark, Cedal, CMI (Coating Measuring Industries), Datacon, Disco, DNS Dpveen, Dynatex, Ewald Instruments,F&K Delvotec, Hesse & Knipps,Hesse, Hughes, Hybond, HyperVision, Karl Suss, Kulicke and Soffa (K&S) , Laurier, Logitech, MBS, MEI, MRSI, Mullen, OAI, Optima, Palomar, Pesl, Research Device Automation, Research Devices, Royce, SEC, Semiconductor Equipment Corporation (SEC), Shinkawa, Suss, TEL, Tosok, TPT, Tresky, Ultron , Unitek .
The main model 2008HS3 Plus, Eagle Express GOCu , DieSeries, 2100 hS, T-3000-FC3 , Delvotec 5610, Royce 550 Die Bonder, 1204W, A7372E, 7374B, 4523, 1204W, 827, 907Series, 1204B, 829Z, 909Series, 20 Wedge, AD896-06, 2200 EVO, Eagle 60, 2200 APM, 5400B, 7400, 7416, 3100, DINP, 3100, Delvotec, Wedge, LAW-820, DBD3550R, UTC1000, M360C, 850TB,7200A, 520, BT, 572-40, DXB, 505Series, SA220, 4000, 572A, 522, 552A 3000, 703, 709/703, 1WBT5, 850Series, 8000, 3088, 2006S, 3018, 4000HS, CP-222, Swissline, 4020Series, 4450, 7200c, 703/709, 454630E-79, 7400B HBSeries OE, 4000, 360C, 20, 6320, 1WBS2, 990, 20R, 2400PC, 7400A, AD809S Series-4000-P, BJ920 M360C, 8000, UH130, 2200, 2100XP, Leadfrme, 3200, 2100FC, 2008, HS3PLUS, 3088CU, AB339, AD898, 898, 2470-V.
HS Code 8486 90 00 for Die Bonder Machine - Parts and Accessories and other machinery from 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays