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Used CVD Equipment

248 results
1

104 CVD Tools in the Line, Like New condition. Year(s) : 2021 Location : EUROPE (Western and Northern)

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Applied Materials 5200 Centura - WCVD Wafersize: 150mm 200mm convertible: Yes Chambers/configuration: 2 WxZ de Year(s) : 1996 Location : EUROPE (Western and Northern)

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Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Number of Chambers 3 Process Capabi Year(s) : 2012 Location : EUROPE (Western and Northern)

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TEL Trias Ti/TiN System TEL MF CVD314-02 WAFER SIZE 12 Year(s) : 2008 Location : EUROPE (Western and Northern)

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Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 150 mm Number of Cassette Platforms 24 Rob Location : EUROPE (Western and Northern)

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1

Chemical Vapor Deposition Equipment 300mm Year(s) : 2017 Location : AMERICA North (USA-Canada-Mexico)

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1

CVD: MOCVD(SIC)/4in. Year(s) : 2014 Location : ASIA (North East)

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CVD: MOCVD/4in Year(s) : 2010 Location : ASIA (North East)

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CVD: MOCVD Year(s) : 2004 Location : ASIA (North East)

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Features: - thin film deposition - encapsulation - coating - eg SiO 2 , SiN x , SiON x , a Si - up to 200 mm w Year(s) : 2015 Location : EUROPE (Western and Northern)

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CVD: MOCVD/4in. Location : ASIA (North East)

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CVD: MOCVD Year(s) : 2006 Location : ASIA (North East)

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The system is configured for analysis and dosing of Dow’s Intervia 8540 Electrolytic Cu plating bath. -20L Res Location : AMERICA North (USA-Canada-Mexico)

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Condition Excellent Year of Manufacture 2012 Year(s) : 2012 Location : EUROPE (Western and Northern)

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200mm, s/n: AD40 Tool ID: ILDEP-02 Year(s) : 1996 Location : AMERICA North (USA-Canada-Mexico)

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200mm, s/n: 5267 Year(s) : 1990 Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Robot Manufacturer/Model Genmark C Year(s) : 2000 Location : EUROPE (Western and Northern)

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OXFORD PLASMALAB 100 PECVD consisting of: - Model: Plasmalab 100 PECVD - Process: SiO2 and SiN deposition - Ma Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)

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CVD: MOCVD/4in. Year(s) : 2001 Location : ASIA (North East)

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CVD: MOCVD/4in. Year(s) : 2010 Location : ASIA (North East)

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1

WJ999R with 996-9 Handler Fully Operational With HDD Still installed in FAB Year(s) : 1998 Location : EUROPE (Western and Northern)

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Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Number of Cassette Platforms 24 Robot Ma Year(s) : 1999 Location : EUROPE (Western and Northern)

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System configured for AsP use Version: 100 mm • E475 Stainless Steel High Efficiency Growth Chamber. Year(s) : 2010 Location : AMERICA North (USA-Canada-Mexico)

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1

4410 sputtering system 3 DELTA TARGETS CTI CRYOPUMP AND COMPRESSOR Vacuum Valves Rebuilt NEW HMI/PLC, REBUILT Location : AMERICA North (USA-Canada-Mexico)

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CVD: PECVD Location : ASIA (North East)

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You can find used  CVD Equipment on Wotol

The main manufacturers of CVD Equipment are AMAT, TEL, Applied Materials, Plasmatherm, Novellus, Aixtron, Oxford, ASM, Kokusai, Varian, Anelva, CVC Products, Canon, CVC, Aixtron, Anatech, Applied, Centrotherm, DNS, Emitech, ESC, First, Hitachi, Industrial, J.C. Schumacher, Jusung Engineering, Kas, Kokusai, Lam Research, Leybold, Matheisson, Mattson, MRC, Novellus, Novellus Systems, Oxford Instruments, Perkin Elmer, SVG, Technica, TEL, Tempress, Tepla, Thomas Swan, Ulvac, Unaxis, Varian, Veeco, Watkins Johnson

The main model P5000Series, Quixace, UltimaX, OCEAN, PXJ-200, C1 TEOS, A412, Eagle XP8, IDC S6961, C-7100GT, K950, 790Series, SLR 730, 643, 7300, 2400-SSA, 601, PT530, Plasmalab 800Series, Raider ECD210 / R310PD23SRD6CFD06AY03, LT-210C 2-2-1, 5000, ATS-15 TLC ABU/TLC, ILC-1012, SRH820, SV-9040-T14, I-2300SRE, APT4800, P-5000, TC2300, SJF-1000, 80B, Eagle-10, ALPHA-303i, L-430S-FHL, VDS-5600, SPEED C2, Endura 5500, SLR-770, NGP1000, TS-81003, Eureka 2000, Ultima X, PEIIA, 1500, 999R, Z-550, SE APF, AMP-3300, ET 3000, Concept-1 200, SC-W60A-AVFG

HS Code 8486 30 21 for Chemical Vapour Deposition (CVD) equipment
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 9 (C) to this Chapter; parts and accessories. 

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