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Used CVD Equipment

243 results
1

Sputtering System 2400 – 8L Load Lock Sputter Deposition Coater Comes with AE MDX 1K RF Power Generator Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Maximum 150 mm Set Size 125 mm Controller Type Microprocessor Controller Type Contr Year(s) : 1997 Location : AMERICA North (USA-Canada-Mexico)

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Typ: 10000186 UV 300/400 50 Hz 3” Chuck, 4” x 4” Mask Holder Objectiv Leitz 5x 0,09; 10x 0,20; 20x 0,40; 32 Year(s) : 2004 Location : EUROPE (Western and Northern)

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Ion implanter Year(s) : 2013 Location : ASIA (North East)

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1

CVD: APCVD Maker AMAYA Model AEC2250SP-296 Location : ASIA (North East)

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CVD: APCVD Year(s) : 1998 Location : ASIA (North East)

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1

PVD:Sputter Maker TEAMS CORPORATION Year(s) : 2018 Location : ASIA (North East)

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CVD: APCVD/6in Location : ASIA (North East)

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Reticle Handler Model RSR160 Year(s) : 2013 Location : EUROPE (Western and Northern)

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Manufacturer Noevllus DKN config Year(s) : 2008 Location : EUROPE (Western and Northern)

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• Process: PECVD iN,SiO2, i-a-Si, SiON and N+ a-Si • SoFware Version: AKT7.3 • System Power RaNng: 208 VAC 3-P Year(s) : 2005 Location : EUROPE (Western and Northern)

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CVD Model Vector Express Year(s) : 2007 Location : EUROPE (Western and Northern)

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Configuration: - MAG7 Brooks Robots - MC3 Novellus Module controller - Pfeiffer Turbo and turbo controller - Location : EUROPE (Western and Northern)

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Optical Microscope, 300mm Cold. Not working parts include: Tango Controller (Microscope Stage controller Joy Location : EUROPE (Western and Northern)

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3 Chambers In Fab, Warm Idle Software version: 2.0405 CIM: E84, SECS-GEM. GEM300, Interface A Hardware Configu Year(s) : 2013 Location : EUROPE (Western and Northern)

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1

CVD/PVD Location : EUROPE (Western and Northern)

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Tool Status: Connected Wafer Size: 300 mm Asset Description: DESPATCH Bake-out Cabinet Oven CIM: NONE Proc Year(s) : 2011 Location : EUROPE (Western and Northern)

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CATHODES: 2 magnetron targets 200mm diameter. SUBSTRATE TRANSPORT LOAD LOCK: for 150mm diameter substrates. SU Location : EUROPE (Western and Northern)

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Diffusion furnace (OX) Year(s) : 2000 Location : ASIA (North East)

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1

Trias CVD PECVD-Oxynitride Year(s) : 2008 Location : EUROPE (Western and Northern)

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Wafer size: 12" Process: Etch OCD Measuring Location : EUROPE (Western and Northern)

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Description PECVD TEOS with Load Lock Wafer Size Range Maximum 200 mm Process PECVD & TEOS Controller T Year(s) : 2001 Location : AMERICA North (USA-Canada-Mexico)

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Furnace LPCVD-Si3N4 WAFER SIZE 12 Year(s) : 2015 Location : EUROPE (Western and Northern)

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WAFER SIZE 300mm Year(s) : 2009 Location : EUROPE (Western and Northern)

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High K Metal CVD and ALD system, NiOx, HfOx process Version: 300 MM Vintage: 01.06.2012 Tokyo Electron Tria Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)

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You can find used  CVD Equipment on Wotol

The main manufacturers of CVD Equipment are AMAT, TEL, Applied Materials, Plasmatherm, Novellus, Aixtron, Oxford, ASM, Kokusai, Varian, Anelva, CVC Products, Canon, CVC, Aixtron, Anatech, Applied, Centrotherm, DNS, Emitech, ESC, First, Hitachi, Industrial, J.C. Schumacher, Jusung Engineering, Kas, Kokusai, Lam Research, Leybold, Matheisson, Mattson, MRC, Novellus, Novellus Systems, Oxford Instruments, Perkin Elmer, SVG, Technica, TEL, Tempress, Tepla, Thomas Swan, Ulvac, Unaxis, Varian, Veeco, Watkins Johnson

The main model P5000Series, Quixace, UltimaX, OCEAN, PXJ-200, C1 TEOS, A412, Eagle XP8, IDC S6961, C-7100GT, K950, 790Series, SLR 730, 643, 7300, 2400-SSA, 601, PT530, Plasmalab 800Series, Raider ECD210 / R310PD23SRD6CFD06AY03, LT-210C 2-2-1, 5000, ATS-15 TLC ABU/TLC, ILC-1012, SRH820, SV-9040-T14, I-2300SRE, APT4800, P-5000, TC2300, SJF-1000, 80B, Eagle-10, ALPHA-303i, L-430S-FHL, VDS-5600, SPEED C2, Endura 5500, SLR-770, NGP1000, TS-81003, Eureka 2000, Ultima X, PEIIA, 1500, 999R, Z-550, SE APF, AMP-3300, ET 3000, Concept-1 200, SC-W60A-AVFG

HS Code 8486 30 21 for Chemical Vapour Deposition (CVD) equipment
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 9 (C) to this Chapter; parts and accessories. 

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