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Used CVD Equipment

255 results
1

COA:Developer Year(s) : 2000 Location : ASIA (North East)

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Precision 5000 Location : AMERICA North (USA-Canada-Mexico)

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Specification : Wafer Size: 200mm Robot: HP(buffer and Transfer) Loadlock: Narrow Bod Location : EUROPE (Western and Northern)

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Thin Flim Deposition Controller Other Information System Components: Control unit: P/N 753-003-G1 Sensor cont Location : AMERICA North (USA-Canada-Mexico)

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1

- Manual Wafer Load Plasma Asher - Used for Wafer Cleaning and Descum - Can Process up to 150mm Wafers - Farad Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

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Deposition tool P500049 4 Chambers 2 Chambers Etch, 2 Chambers CVD Teos Year(s) : 2000 Location : ASIA (North East)

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Chamber : 3 units Mark II Univesal Chambers Year(s) : 1993 Location : ASIA (North East)

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Process Chamber : 3 units Mark II Univesal Chambers Year(s) : 1995 Location : ASIA (North East)

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Process Chamber : 3 units Mark II Univesal Chambers Year(s) : 1996 Location : ASIA (North East)

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Standard Mainframe with 2 Argon Sputter Chambers Year(s) : 2000 Location : ASIA (North East)

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1

Description Gen 5 PEVCD Chamber - New Accessories Substrate Size: 1200 mm x 1300 mm Location : AMERICA North (USA-Canada-Mexico)

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Gen 6 PEVCD Chamber - Accessories Substrate Size: 1500 mm x 1850 mm MKS ASTeX Remote Plasma Source, Model: Location : AMERICA North (USA-Canada-Mexico)

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1

CD-60 Super Catalytic Decomposition System Location : AMERICA North (USA-Canada-Mexico)

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1

ex-1204 (exhaust controller) cable(cx-1204 mainbody) Year(s) : 1988 Location : ASIA (China - Taiwan - HKG)

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Load-locked, fully automated (CX 2003A controller) High throughput Cassette-to-cassette vertical react Location : AMERICA North (USA-Canada-Mexico)

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1

VTP 1500 LH LPCVD (SiN) Reactor is configured for SiN processing of 200 mm wafers. System is fully automated w Location : AMERICA North (USA-Canada-Mexico)

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4504 Four Stack LPCVD Reactor configured for PolySi, Silicon Nitride, SiO2/PSG/BPSG, and TEOS/PTEOS/BPTEOS. Sy Location : AMERICA North (USA-Canada-Mexico)

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1

Wafer size: 300mm Process: CVD Year(s) : 2010 Location : EUROPE (Western and Northern)

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CVD Tool with 4 Chambers 2 Chambers Etch, 2 Chambers CVD SILAN Location : EUROPE (Western and Northern)

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1

WAFER SIZE 6 Year(s) : 1995 Location : EUROPE (Western and Northern)

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12

Chemical vapor deposition 2007 or 2008 Evaporation Pyrolyse Tank dia 700 x670 h Pump edwards em80 Year(s) : 2007 Location : EUROPE (Western and Northern)

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1

CVD: MOCVD Year(s) : 2013 Location : ASIA (North East)

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PVD cluster tool with 6 chambers (Used for Al, Ti, NiV and AG) Version: 200 mm Year(s) : 2005 Location : AMERICA North (USA-Canada-Mexico)

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Fill Sputter Deposition System Version: 125 mm Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

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VDS-5500 Description P-CVD Year(s) : 1988 Location : ASIA (North East)

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You can find used  CVD Equipment on Wotol

The main manufacturers of CVD Equipment are AMAT, TEL, Applied Materials, Plasmatherm, Novellus, Aixtron, Oxford, ASM, Kokusai, Varian, Anelva, CVC Products, Canon, CVC, Aixtron, Anatech, Applied, Centrotherm, DNS, Emitech, ESC, First, Hitachi, Industrial, J.C. Schumacher, Jusung Engineering, Kas, Kokusai, Lam Research, Leybold, Matheisson, Mattson, MRC, Novellus, Novellus Systems, Oxford Instruments, Perkin Elmer, SVG, Technica, TEL, Tempress, Tepla, Thomas Swan, Ulvac, Unaxis, Varian, Veeco, Watkins Johnson

The main model P5000Series, Quixace, UltimaX, OCEAN, PXJ-200, C1 TEOS, A412, Eagle XP8, IDC S6961, C-7100GT, K950, 790Series, SLR 730, 643, 7300, 2400-SSA, 601, PT530, Plasmalab 800Series, Raider ECD210 / R310PD23SRD6CFD06AY03, LT-210C 2-2-1, 5000, ATS-15 TLC ABU/TLC, ILC-1012, SRH820, SV-9040-T14, I-2300SRE, APT4800, P-5000, TC2300, SJF-1000, 80B, Eagle-10, ALPHA-303i, L-430S-FHL, VDS-5600, SPEED C2, Endura 5500, SLR-770, NGP1000, TS-81003, Eureka 2000, Ultima X, PEIIA, 1500, 999R, Z-550, SE APF, AMP-3300, ET 3000, Concept-1 200, SC-W60A-AVFG

HS Code 8486 30 21 for Chemical Vapour Deposition (CVD) equipment
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 9 (C) to this Chapter; parts and accessories. 

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