Used CVD Equipment
195 results4504 Four Stack LPCVD Reactor configured for PolySi, Silicon Nitride, SiO2/PSG/BPSG, and TEOS/PTEOS/BPTEOS. Sy Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details<b>1x, Novellus, Concept 1 CVD</b> 200mm Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsBrand: Applied Materials Model: P5000 CVD SYSTEM Specifications • Used • Description CVD System • Reference N Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsChemical vapor deposition 2007 or 2008 Evaporation Pyrolyse Tank dia 700 x670 h Pump edwards em80 Year(s) : 2007 Location : EUROPE (Western and Northern)
Price : On request
More detailsCVD: MOCVD Year(s) : 2013 Location : ASIA (North East)
Price : On request
More detailsK465 Description CVD: MOCVD Year(s) : 2008 Location : ASIA (North East)
Price : On request
More detailsElectroplating Deposition Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsGold Deplater Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsDeposition PECVD / HDPCVD (3) Chamber Year(s) : 2011 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsSemitool LT210C Gold Deplater Year(s) : 2001 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsPrecision 5000 Mark II Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsILC-1012 Description PVD: Sputter Location : ASIA (North East)
Price : On request
More detailsSRH820 Description PVD: Sputter Year(s) : 2006 Location : ASIA (North East)
Price : On request
More detailsSV-9040-T14 Description PVD: Sputter Location : ASIA (North East)
Price : On request
More detailsSpecifications: Parallel plate 15" chamber Microprocessor controller 11" electrode 500 Watt @ Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsFeatures: Capable of 100mm, 125mm, 150mm, and 200mm wafer processing Process extendibility from 0.5 mi Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsSpecifications: Software version: 2.85.6 Process extendibility from 0.5 micron to 0.08 micron WJ-9 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsBrand: W-j Wj TEOS-NSG WJ999 160422-006 TEOS CVD WJ999 S/N：4638 Location : ASIA (North East)
Price : On request
More details- SOG deposition - one spin module - bakes (HH,H,cool) - vertical furnace Year(s) : 1994 Location : EUROPE (Western and Northern)
Price : On request
More detailsBrand: Novellus Year: 2005 CVD – HDP Specifications • Used • Vintage 2005 • Process CVD – HDP • Wafer Size Year(s) : 2005 Location : ASIA (South East)
Price : On request
More detailsYou can find used CVD Equipment on Wotol
The main manufacturers of CVD Equipment are AMAT, TEL, Applied Materials, Plasmatherm, Novellus, Aixtron, Oxford, ASM, Kokusai, Varian, Anelva, CVC Products, Canon, CVC, Aixtron, Anatech, Applied, Centrotherm, DNS, Emitech, ESC, First, Hitachi, Industrial, J.C. Schumacher, Jusung Engineering, Kas, Kokusai, Lam Research, Leybold, Matheisson, Mattson, MRC, Novellus, Novellus Systems, Oxford Instruments, Perkin Elmer, SVG, Technica, TEL, Tempress, Tepla, Thomas Swan, Ulvac, Unaxis, Varian, Veeco, Watkins Johnson
The main model P5000Series, Quixace, UltimaX, OCEAN, PXJ-200, C1 TEOS, A412, Eagle XP8, IDC S6961, C-7100GT, K950, 790Series, SLR 730, 643, 7300, 2400-SSA, 601, PT530, Plasmalab 800Series, Raider ECD210 / R310PD23SRD6CFD06AY03, LT-210C 2-2-1, 5000, ATS-15 TLC ABU/TLC, ILC-1012, SRH820, SV-9040-T14, I-2300SRE, APT4800, P-5000, TC2300, SJF-1000, 80B, Eagle-10, ALPHA-303i, L-430S-FHL, VDS-5600, SPEED C2, Endura 5500, SLR-770, NGP1000, TS-81003, Eureka 2000, Ultima X, PEIIA, 1500, 999R, Z-550, SE APF, AMP-3300, ET 3000, Concept-1 200, SC-W60A-AVFG
HS Code 8486 30 21 for Chemical Vapour Deposition (CVD) equipment
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 9 (C) to this Chapter; parts and accessories.