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Used CVD Equipment

257 results
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Delta TEOS DxL / 3C/H Wafer Size 8" Year(s) : 1998 Location : AMERICA North (USA-Canada-Mexico)

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Brand: JPEL P-CVD Lead Time Immediately Year(s) : 1999 Location : ASIA (North East)

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DxL Wafer Size 8" Location : ASIA (North East)

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Vertical Furnace for LPCVD SOD Process Version: 200 mm Vintage: 01.06.2007 Vintage 2007.01 Software OS L Year(s) : 2007 Location : AMERICA North (USA-Canada-Mexico)

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Sputtering System 2400 – 8L Load Lock Sputter Deposition Coater Comes with AE MDX 1K RF Power Generator Location : AMERICA North (USA-Canada-Mexico)

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8 inch substrate. Manual load/unload. Vacuum function. Location : AMERICA North (USA-Canada-Mexico)

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PVD cluster tool Version: 150 mm Vintage: 01.06.1990 This tool was not operational prior to removal and has m Year(s) : 1990 Location : AMERICA North (USA-Canada-Mexico)

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ICP PECVD system for solar cells production Version: Solar Vintage: 01.06.2015 -STILL INSTALLED. IN EXCELLENT Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)

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Materials Research Corp. 8671 RF Sputtering Vacuum Chamber Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Maximum 150 mm Set Size 125 mm Controller Type Microprocessor Controller Type Contr Year(s) : 1997 Location : AMERICA North (USA-Canada-Mexico)

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Description PECVD TEOS with Load Lock Wafer Size Range Maximum 200 mm Process PECVD & TEOS Controller T Year(s) : 2001 Location : AMERICA North (USA-Canada-Mexico)

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Vacuum System None Vacuum System Chamber made up of the 8" CF 4-way cross, M/N: 600-4T, 304SS 8" CF Door/V Location : AMERICA North (USA-Canada-Mexico)

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Description In-Line Sputtering System Vacuum System Diffusion Pumped Load Lock Included Yes Power Requireme Location : AMERICA North (USA-Canada-Mexico)

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Description Gen 5 PEVCD Chamber - New Accessories Substrate Size: 1200 mm x 1300 mm Location : AMERICA North (USA-Canada-Mexico)

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Gen 6 PEVCD Chamber - Accessories Substrate Size: 1500 mm x 1850 mm MKS ASTeX Remote Plasma Source, Model: Location : AMERICA North (USA-Canada-Mexico)

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High K Metal CVD and ALD system, NiOx, HfOx process Version: 300 MM Vintage: 01.06.2012 Tokyo Electron Tria Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)

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EFEM Unit Only Version: 300 mm Vintage: 01.07.2006 DEINSTALLED AND WAREHOUSED CAN BE INSPECTED BY APPOINTMEN Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

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Vertical Furnace Oxide Process Version: 200 mm Vintage: 01.08.1999 Comments: 1 Process Oxide 2 Wafer Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)

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Deinstalled, warehoused. 120V 50 HZ SETUP Location : AMERICA North (USA-Canada-Mexico)

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-Double Stack SRD (Set up for solar wafer use) -in excellent , operational condition -Has CE mark -See attache Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)

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Fill Sputter Deposition System Version: 125 mm Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

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1

CD-60 Super Catalytic Decomposition System Location : AMERICA North (USA-Canada-Mexico)

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Load-locked, fully automated (CX 2003A controller) High throughput Cassette-to-cassette vertical react Location : AMERICA North (USA-Canada-Mexico)

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11

VTP 1500 LH LPCVD (SiN) Reactor is Configured for SiN processing of 200 mm wafers. System Is fully automated w Year(s) : 1995 Location : AMERICA North (USA-Canada-Mexico)

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4504 Four Stack LPCVD Reactor configured for PolySi, Silicon Nitride, SiO2/PSG/BPSG, and TEOS/PTEOS/BPTEOS. Sy Location : AMERICA North (USA-Canada-Mexico)

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You can find used  CVD Equipment on Wotol

The main manufacturers of CVD Equipment are AMAT, TEL, Applied Materials, Plasmatherm, Novellus, Aixtron, Oxford, ASM, Kokusai, Varian, Anelva, CVC Products, Canon, CVC, Aixtron, Anatech, Applied, Centrotherm, DNS, Emitech, ESC, First, Hitachi, Industrial, J.C. Schumacher, Jusung Engineering, Kas, Kokusai, Lam Research, Leybold, Matheisson, Mattson, MRC, Novellus, Novellus Systems, Oxford Instruments, Perkin Elmer, SVG, Technica, TEL, Tempress, Tepla, Thomas Swan, Ulvac, Unaxis, Varian, Veeco, Watkins Johnson

The main model P5000Series, Quixace, UltimaX, OCEAN, PXJ-200, C1 TEOS, A412, Eagle XP8, IDC S6961, C-7100GT, K950, 790Series, SLR 730, 643, 7300, 2400-SSA, 601, PT530, Plasmalab 800Series, Raider ECD210 / R310PD23SRD6CFD06AY03, LT-210C 2-2-1, 5000, ATS-15 TLC ABU/TLC, ILC-1012, SRH820, SV-9040-T14, I-2300SRE, APT4800, P-5000, TC2300, SJF-1000, 80B, Eagle-10, ALPHA-303i, L-430S-FHL, VDS-5600, SPEED C2, Endura 5500, SLR-770, NGP1000, TS-81003, Eureka 2000, Ultima X, PEIIA, 1500, 999R, Z-550, SE APF, AMP-3300, ET 3000, Concept-1 200, SC-W60A-AVFG

HS Code 8486 30 21 for Chemical Vapour Deposition (CVD) equipment
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 9 (C) to this Chapter; parts and accessories. 

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