Used Semiconductor Equipment

[Specifications] - Model year: 2012 - Measurement principle: VSI method: White light vertical scanning interfe Year(s) : 2012 Location : ASIA (North East)

Price : On request

Oxford Instruments OPAL ALD Atomic Layer Deposition System. The Oxford OpAL is a plasma or thermal assisted a Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Wafer Size Range Minimum 150 mm Maximum 150 mm Set Size 150 mm Condition Good Power Requirements Year(s) : 2000 Location : EUROPE (Western and Northern)

Price : On request

Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Condition Excellent Power Requirements Location : EUROPE (Western and Northern)

Price : On request

AOI System Year(s) : 2007 Location : EUROPE (Western and Northern)

Price : On request

*. Process: wafer Sheet Resistance measurement *. Measurement perfomance: - 4 Point Probe check surface on Sil Year(s) : 1998 Location : ASIA (North East)

Price : On request

Laurier HA-250 Semi-Automatic Epoxy Die Bonder The unit powers up and seems to head up. Minor fixes may need Year(s) : 1994 Location : EUROPE (Western and Northern)

Price : On request

X-Ray Inspection System Model XD7600NT Year(s) : 2009 Location : EUROPE (Western and Northern)

Price : On request

WSS Glass Demount Wafer Size Range Set Size 200 mm Condition Very Good Year(s) : 2014 Location : EUROPE (Western and Northern)

Price : On request

The IVS120 is an automatic metrology system designed for measuring critical dimensions (CD´s). Power Requirem Year(s) : 1998 Location : EUROPE (Western and Northern)

Price : On request

Condition Good Power Requirements 220 V 24.0 A 15.0 A(2) 50 Hz 3 Phase Year(s) : 2008 Location : EUROPE (Western and Northern)

Price : On request

Wafer Size 200 mm Fab Section Thin Film General Product Information Vendor Supplier AMAT Model CENTURA MCVD S Year(s) : 2001 Location : United States (USA)

Price : On request

Wafer inspection system WS-75BU, WS-70LCKT/15M Location : EUROPE (Western and Northern)

Price : On request

Wafer Inspection System Model 7555.0 Location : EUROPE (Western and Northern)

Price : On request

The system was deinstalled in september 2002 and until that date was upgraded with various hardware and soft Location : EUROPE (Western and Northern)

Price : On request

WAFER SPECIFICATION Wafer Size 150mm SYSTEM CONFIGURATION CHAMBER A CHAMBER B Year(s) : 2007 Location : EUROPE (Western and Northern)

Price : On request

Condition Good Power Requirements 200-240 V 50/60 Hz 3 Phase Weight 1,213 lb (550 kg) Year(s) : 2011 Location : EUROPE (Western and Northern)

Price : On request

Tool still maintained within Basic-Maintenance contract by KLA! Condition Excellent Power Requirements 208 V Year(s) : 2017 Location : EUROPE (Western and Northern)

Price : On request

Wafer Size 200 mm Fab Section Thin Film Tool Available Date 2024-10-31 General Product Information Vendor Sup Year(s) : 1996 Location : United States (USA)

Price : On request

Wafer Size 300 mm Fab Section Thin Film General Product Information Vendor Supplier AMAT Model PECVD Producer Year(s) : 2014 Location : United States (USA)

Price : On request

The KLA is complete and refurbished in 2015. No known condition issues. Year(s) : 1992 Location : EUROPE (Western and Northern)

Price : On request

3 Ports: 200 mm / 300 mm Refurbished Location : EUROPE (Western and Northern)

Price : On request

Automatic Defect Inspection Machine Model NSX 95 Location : EUROPE (Western and Northern)

Price : On request

Wafer Size 200 mm Fab Section Diffusion General Product Information Vendor Supplier Tokyo Electron Limited Mo Year(s) : 1994 Location : United States (USA)

Price : On request

Wafer Size 200 mm Fab Section CMP General Product Information Asset Description Ebara 222 Oxide CMP-STI Softw Year(s) : 2000 Location : United States (USA)

Price : On request