Used Semiconductor Equipment

EVG 520 WAFER BONDER consisting of: - Model: EVG 520 - Manual wafer load substrate bonder - Capable of fusion Location : AMERICA North (USA-Canada-Mexico)

Price : On request

• Equipment Type: Plasma Cleaner / Plasma Etcher • Power: 750 W • Gas Capability: 3 gases • Chamber Size: 10" Location : AMERICA North (USA-Canada-Mexico)

Price : On request

• Chuck Size: Configured with 4" chuck • Wafer Capacity: 6" capable Location : AMERICA North (USA-Canada-Mexico)

Price : On request

A MXP ETCH B MXP ETCH C MXP ETCH Good Condition Year(s) : 1997 Location : EUROPE (Western and Northern)

Price : On request

Type: ICP HR Etch System Wafer Size: 8" Location : EUROPE (Western and Northern)

Price : On request

Dual etch chamber system with handler Model 602E Year(s) : 2002 Location : EUROPE (Western and Northern)

Price : On request

Wire Bonder Model Eagle 60 Year(s) : 2007 Location : EUROPE (Western and Northern)

Price : On request

Includes Hesse DA 04 051 Deep Access Bondhead & Light Tower; Number of Bonds Approx 37,054,610; Dimensions o Year(s) : 2009 Location : EUROPE (Western and Northern)

Price : On request

Insp: X-Ray Inspection System Year(s) : 2009 Location : ASIA (North East)

Price : On request

• Fully automatic grinding-polishing system • Capacity: Up to 6 samples • Operation: Fully automated, no conti Location : AMERICA North (USA-Canada-Mexico)

Price : On request

7 sets ASM Harrier Bonders Vintage 2009~2010 Working condition Year(s) : 2009, 2010 Location : EUROPE (Western and Northern)

Price : On request

This West-Bond 545657B is a Semi-Automatic Three-Way Convertible 45° Wire Feed Wedge, 90° Wire & Ribbon Feed Location : EUROPE (Western and Northern)

Price : On request

Die Bonder Model AD809M-06 Year(s) : 2002 Location : EUROPE (Western and Northern)

Price : On request

CVD: MOCVD/6in. Year(s) : 2023 Location : ASIA (North East)

Price : On request

CVD: MOCVD Year(s) : 2012 Location : ASIA (North East)

Price : On request

Vintage : APR 2010 120/208V 3 Phase 15" Max Board Width Specifications ( See Details above for installed opti Year(s) : 2010 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Provides the High Yields and Excellent Repeatability Needed for All Gold Ball Bonding Applications Including: Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Plasmatherm SLR-720/720 Dual Chamber RIE Reactive Ion Etch System. PC controller with graphical user interfac Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Plasmatherm SLR ICP Shuttle Lock ICP Inductively Coupled Plasma Etch System. PC controller. Vacuum load loc Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Includes: FINEPLACER lambda Bonding force module FD3 Chip heating module Optional Dispensing Module FG3 WinFli Year(s) : 2017 Location : EUROPE (Western and Northern)

Price : On request

ASM AD898 die bonder, 2 sets ASM AD898 for sale Ex works China , both vintage 2006, Can Trial Run. Year(s) : 2002 Location : EUROPE (Western and Northern)

Price : On request

Nikon Eclipse L200D Nomarski 8" Wafer Inspection Microscope with Camera and Measuring Software. Includes a S Location : AMERICA North (USA-Canada-Mexico)

Price : On request

K&S 4524D Programmable Digital Ball Bonder. Manages 200 programs with up to six channels per program. Digita Location : AMERICA North (USA-Canada-Mexico)

Price : On request

West Bond 353637E-90 Automatic, Gantry, Large Area, Triple-Convertible Wire Bonder. Currently configured for Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Wafer Size Range Set Size 200 mm Power Requirements 208 V 80.0 A 50/60 Hz 3 Phase CE Marked Y Year(s) : 1999 Location : EUROPE (Western and Northern)

Price : On request