Used Semiconductor Equipment
3,668 resultsSubcategories
TEL Mark-7 Track 2C 3D installed as is where is 50% down, and 50% prior to deinstall Location : EUROPE (Western and Northern)
Price : On request
More detailsSOG Spin Coat L Configuration - Load on the Left, Cure Furnace on the Right 25 Slot Cassette Oven type: (4) H Year(s) : 2015 Location : EUROPE (Western and Northern)
Price : On request
More detailsMain Controller Type: NA Wafer Flow: Right to Left Co Year(s) : 2004 Location : EUROPE (Western and Northern)
Price : On request
More detailsWire Bonder Model Maxum Location : EUROPE (Western and Northern)
Price : On request
More detailsWorking condition Location : EUROPE (Western and Northern)
Price : On request
More detailsBonders Model EAGLE AERO Year(s) : 2018 Location : EUROPE (Western and Northern)
Price : On request
More detailsThis Orthodyne 20 Ultrasonic Heavy Wire Bonder with Wire Dereeler looks to be in good cosmetic condition, sh Location : EUROPE (Western and Northern)
Price : On request
More detailsThis K&S (Kulicke & Soffa) model 4124 Manual Gold Ball Wire Bonder looks to be in good cosmetic condition, sh Location : EUROPE (Western and Northern)
Price : On request
More detailsWire Bonders Model Eagle Xtreme Year(s) : 2012 Location : EUROPE (Western and Northern)
Price : On request
More detailsKulicke and Soffa (K&S) 4123 Wire Bonder General Specs: Wire Diameter Range : Gold - 0.5 to 3.0 mils (12.7 to Location : EUROPE (Western and Northern)
Price : On request
More detailsThis K&S (Kulicke & Soffa) model 4124 Manual Gold Ball Wire Bonder looks to be in good cosmetic condition, sho Location : EUROPE (Western and Northern)
Price : On request
More details- Model: ABC200 - MHU - Main Handling Unit w/ Genmark GB8 Robot - Module 1: BA200 – Bond Aligner - Module 2: N Location : EUROPE (Western and Northern)
Price : On request
More detailsA MXP ETCH B MXP ETCH C MXP ETCH Good Condition Year(s) : 1997 Location : EUROPE (Western and Northern)
Price : On request
More detailsType: ICP HR Etch System Wafer Size: 8" Location : EUROPE (Western and Northern)
Price : On request
More detailsDual etch chamber system with handler Model 602E Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More detailsWire Bonder Model Eagle 60 Year(s) : 2007 Location : EUROPE (Western and Northern)
Price : On request
More detailsIncludes Hesse DA 04 051 Deep Access Bondhead & Light Tower; Number of Bonds Approx 37,054,610; Dimensions o Year(s) : 2009 Location : EUROPE (Western and Northern)
Price : On request
More details7 sets ASM Harrier Bonders Vintage 2009~2010 Working condition Year(s) : 2009, 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsThis West-Bond 545657B is a Semi-Automatic Three-Way Convertible 45° Wire Feed Wedge, 90° Wire & Ribbon Feed Location : EUROPE (Western and Northern)
Price : On request
More detailsDie Bonder Model AD809M-06 Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More detailsIncludes: FINEPLACER lambda Bonding force module FD3 Chip heating module Optional Dispensing Module FG3 WinFli Year(s) : 2017 Location : EUROPE (Western and Northern)
Price : On request
More detailsASM AD898 die bonder, 2 sets ASM AD898 for sale Ex works China , both vintage 2006, Can Trial Run. Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More details Wafer Diameter Maximum 12" (300 mm) Wafer XY Table Travel (13” x 13”) 334 x 334mm Die Size (10 x 10 mil Year(s) : 2004 Location : EUROPE (Western and Northern)
Price : On request
More detailsStill inside crates Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsProcess: Die Attach Condition: Working Year(s) : 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsYou can find used Semiconductor Equipment on Wotol
For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.