Used Wafer Equipment
403 results- Wafer Size: 150mm & 200mm wafer capable - Process: DI water/ozone - Rinse: DI water with ammonium hydroxide Year(s) : 2004 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsAligner Wafer Size 6" Location : ASIA (North East)
Price : On request
More detailsWafer Size 5 Year(s) : 1994 Location : ASIA (North East)
Price : On request
More detailsSTYLUS TYPE PROFILOMETER FOR MEASURING STEPS ON UP TO 6" WAFERS 360 DEGREE STAGE ROTATION 100 ANGSTROM TO 1310 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWafer Size 12 Year(s) : 2012 Location : ASIA (North East)
Price : On request
More detailsAligner Location : ASIA (North East)
Price : On request
More detailsWAFER TESTER FOR WAFER THICKNESS INCLUDES LARGE ANVIL STYLE TABLE TO HOLD SMALL OR LARGE SUBSTRATES Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsFOR MEASURING DIELECTRIC THIN FILMS ON WAFERS UP TO 8" DIAMETER INCLUDES COMPUTER WITH MAPPING Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsNIDEC SANKYO Corporation Condition Good Weight 1,433 lb (650 kg) Serial Number(s) FR00891253 Year(s) : 2008 Location : EUROPE (Western and Northern)
Price : On request
More detailsConfiguration: KLA-Tencor 8100XP CD-SEM is an advanced metrology instrument with capability to provide super Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsAligner: Mask Year(s) : 2002 Location : ASIA (North East)
Price : On request
More detailsdie matrix expander max 150mm wafers Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailswafer diameter 2"-6" heated wafer stage Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsProgrammer 10 programs of up to 10 steps each Custom base cabinet with pull out photoresist cannister tray Max Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsLeica objectives 3.5x/10x/20x 350W lamphouse with Ushio USH-350DS Hg lamp UV400 near UV optics, 350-450nm, 0. Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsCurrently Configured for 200mm Wafer Handling Dual Open Cassette Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsCoat/Develop Cluster Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsPatterned Wafer Surface Inspection Year(s) : 1997 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsPerformance Specification: • Feature Size: < 30 nm • Resolution: < 4 nm • Electron Source: Schottky, Therm Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsPerformance Specification: • Feature Size: < 30 nm • Resolution: < 4 nm • Electron Source: Schottky, Therm Year(s) : 2005 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsMikroskop 220 V ~ / 50 - 60 Hz / 20 VA B (width) m / T (depth) m H (height) m / G (weight) kg Yes) good Location : EUROPE (Western and Northern)
Price : On request
More detailsOther: Autocollimator Location : ASIA (North East)
Price : On request
More detailsPM-5 manual prober with 6in vacuum chuck and Mitutoyo FS60 microscope with motorized XY Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsA Zoom video system with 2x/5x/10x/50x objectives XYZ-theta motorized stage with joystick control Optional PC Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsConfiguration: - Wafer Size : 4 - 8 inch. - Non-patterned surface Inspection System. - 0.1 micron Defect Sensi Year(s) : 1995 Location : ASIA (North East)
Price : On request
More detailsYou can find used Wafer Equipment on Wotol
The main manufacturers of Wafer Equipment are KLA-Tencor, Karl Suss, Canon, Electroglas, Suss, Nikon, Semitool, TEL, Tokyo Semitsu Kogaku (TSK), Branson / IPC, MGI, Ultron, EVG, Allwin21, Abm, Accretech, ADE, AG Associates, AIO, Alessi, Applied Materials, ASM, ASML, Asyst Technologies, ATMI, Axcelis, Brooks Automation, Buehler, Cambridge, Cascade, Cascade Microtech, CDE (Creative Design Engineering), CEE, CHA, Control Micro Systems (CMS), Cymer, Dainippon Screen,Dektak, Denton, Disco, DNK, DNS, Dynapert, Dynatex, Electroglass, EV Group, Evergreen, Faith, Fluoroware, Fortrend Engineering, Gasonics, GCA, GSI Lumonics, Hitachi, HTG, IMT, InspecTech, Ionic Systems, Jeol, K & S, Kensington, KLA, Kokusai, LAM, Lam Research, Leica, Lintec, Loomis, Lumonics, Mactronix, Matsushita, Mech-El, Micro Automation, MRC, MTI, Nanometrics, Nitto, OAI, Olympus, Oriel, Oxford, Perkin Elmer, PRI, Prometrix, Recif SA, Rucker & Kolls, Suss MicroTec, SVG, Takatori, Tegal, Tencor, Tropel, Ultracision, Ultratech, Ulvac, Veeco, Verteq, Wentworth, Xynetics
The main model MPASeries, CDS-650CT, PLA-501F, MA-4100, NSR-1505G4, 1000, Titan II, MA150, 6033, 2029,2020,2025, 6200Series, SM200E, Step 200,UM810, UH-130, UF3000 EX, SFX100, M777, FPA-5500iZa, SR8220-019, Desktop 1, 270 SRD, ST-260, 1600-55, 8100XP, 8100Series, 1H-DX, KP-4200, MA-4201Series, MA-1006, L200,UH130M,DFM-M150, CEE 100, SP323, MJB3Series, JWSSeries, MA6Series, SWC4000, EX-5700, 2001X, MDA-60FA, 680A, 8300, ARM200CF, S-5200, S-4700, AS5000, Axiotron II, INS330, Axiospect 301, SF 600, WaferMark II,3308, MASeries, 20T2/150VPO, 860, 1600-55A, UH 102, 4000, Eureka 450, ETI0392A-6-U, 425130, ETII-6910B-X-V, EET1-0395D-X-U, ETII-6910B-X-V, F-6225, 827, 907, 211,UVSeries, AIT8010, eCD2, 8100XPR, CD-SEMSeries, 8250, PC 4400, 300405, SFS 6420, 6D, MM-Cascade 6100, MJB-55, 179884/ P-2 OPEN FRAME, 8300X, 4500, ATRM-2100, SWC11, MAS-8000,ATM-1100E, 3A, 90, RTP-600xp, UKA-650, SPP8, MP 2300, BH-BHM, 2066,AL100-L8, IDLW8R, REL-4500, IDLW8R, MAS-8000, Fix Load25, UKA-825, SCW111, ATRM-2100D, 4055/2, Optistation 3, REL-4500, ResMap 178, 8097, 1600-55m, LSD 100, DSL 10, H100, RHM-06, 908, UH-130, 600W, 100FX, RS 35, P16+, 8620, MA8/BA8 Gen3, lle-855SS, 85DD, SFS7700, 2300 Versys, ZX-1000, Mark7, S-7800HSA, 5610,ES3, M-GAUGE 200, AITI,SFS7200, THERMA-WAVE OP 2600, MA150, 2115, 9400, NGP80, 620, XRF3640, CTR-200, TREX 610, F-4225, EET10395-4-U, SYO-200SS, MS100, RS-75, 7400/18, 2001X 6, PLA-501FA, PS300 Parametric Serie 12, DX-III, SHS 1000VAC, V300-Si, 12", WM650, AlphaStep 300, SURFSCAN 7700, 903eSeries, F6000QS, SP1 TB1, Nanolab 600, NWL860-TMB-SP, F5, DSS200, RS35C, MX-50, DD-823V-8BL, MicroSense 6300, 2400, 4400,E5200, 8108, 600FA, 40, MRC 603, 7700, VersaPort 2200, R-3, SSEC M10, ST-270 SRD, L3510, HTC 8020, Lumonics III, 1800-6AR, HTC 4000, SSW-60A-AR, 1034X, WST 306, ST-860, KIS 2000, L3510E, 9350, PSM 6, 80B, RS-35, DR-8500 II, 301, VLR RIE LM/TM, 20T2/150VPO, 1034 XA – 6, 4085XSeries, 682A, 500R 120-1007, E8025S, 100 RIE, M6000L, EV CS50, 150, RC8, ATM-105-1-S-CE-S293, MPC3000, DMI4000B, 5100, F5x, P-10, LP-200H, F200, CMS1030, CW1002-6200RW, 8860, APM90A, 3001X, APM5000, 880
HS Code 8486 10 10 for Apparatus for rapid heating of semiconductor wafers.
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devicesde8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices