Used Wafer Equipment
364 results- Bare wafer surface defect inspection system - Substrate/Sizes: 2" - 12" Wafer Capable (Chuck and Carrier typ Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsP-1 Long Scan Profiler is a computerized, high-sensitivity surface profiler that measures roughness, waviness, Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsJWS 7555S Year(s) : 2001 Location : ASIA (China - Taiwan - HKG)
Price : On request
More detailswafer 200mm as-is complete working condition Location : ASIA (China - Taiwan - HKG)
Price : On request
More detailsOnly the Laser system, deinstall from ASML Twincan XT1250B ARF Scanner Year(s) : 2004 Location : ASIA (China - Taiwan - HKG)
Price : On request
More detailswafer 200mm as-is complete working condition Location : ASIA (China - Taiwan - HKG)
Price : On request
More detailsONTRAK S2 CLASSIC Location : ASIA (China - Taiwan - HKG)
Price : On request
More detailswafer size: 4/5/6/8 inch Applicable wafer thickness: 300-1000um Power supply: 110V fully refurbished, all func Location : ASIA (China - Taiwan - HKG)
Price : On request
More details- Configured for Top Side Alignment - Includes one Chuck (Customer to Choose Size) - Includes one Maskholder ( Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details- Topside Alignment (TSA) - Automatic Mask Aligner - Cassette to cassette operation - Can be used in either Au Year(s) : 2001 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details- Wafer Size: 150mm & 200mm wafer capable - Process: DI water/ozone - Rinse: DI water with ammonium hydroxide Year(s) : 2004 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsCurrently Configured for 200mm Wafer Handling Dual Open Cassette Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsMax Wafer: 200mm Configuration: Topside Alignment, 350W Lamphouse, UV400 Optics - Topside Alignment - 350W Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details- Up to 8"/200mm wafer handling - Allows small batch processing for R&D and Pilot Production - Load-locked Sys Year(s) : 2007 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsMax Wafer: 200mm System Dimensions: 30x40x66 Weight: 695 lbs - Automatic Surface Inspection System - Bare W Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsMA150CC MANUAL TOPSIDE ALIGNER WAFER SIZE: 150MM Location : ASIA (China - Taiwan - HKG)
Price : On request
More detailsWAFER SIZE: 150MM Location : ASIA (China - Taiwan - HKG)
Price : On request
More detailsMARK V TRACK 2 Coat 2 Dev As-Is wafer size: 150mm Year(s) : 1997 Location : ASIA (China - Taiwan - HKG)
Price : On request
More detailsInspection: wafer Year(s) : 2008 Location : ASIA (North East)
Price : On request
More detailsdie matrix expander max 150mm wafers Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailswafer diameter 2"-6" heated wafer stage Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsProgrammer 10 programs of up to 10 steps each Custom base cabinet with pull out photoresist cannister tray Max Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsLeica objectives 3.5x/10x/20x 350W lamphouse with Ushio USH-350DS Hg lamp UV400 near UV optics, 350-450nm, 0. Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsNanomaster APPLICATIONS: Patterned and Un-patterned Masks and Wafers Ge, GaAs and InP Wafer Cleaning Post CMP Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsPM-5 manual prober with 6in vacuum chuck and Mitutoyo FS60 microscope with motorized XY Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsYou can find used Wafer Equipment on Wotol
The main manufacturers of Wafer Equipment are KLA-Tencor, Karl Suss, Canon, Electroglas, Suss, Nikon, Semitool, TEL, Tokyo Semitsu Kogaku (TSK), Branson / IPC, MGI, Ultron, EVG, Allwin21, Abm, Accretech, ADE, AG Associates, AIO, Alessi, Applied Materials, ASM, ASML, Asyst Technologies, ATMI, Axcelis, Brooks Automation, Buehler, Cambridge, Cascade, Cascade Microtech, CDE (Creative Design Engineering), CEE, CHA, Control Micro Systems (CMS), Cymer, Dainippon Screen,Dektak, Denton, Disco, DNK, DNS, Dynapert, Dynatex, Electroglass, EV Group, Evergreen, Faith, Fluoroware, Fortrend Engineering, Gasonics, GCA, GSI Lumonics, Hitachi, HTG, IMT, InspecTech, Ionic Systems, Jeol, K & S, Kensington, KLA, Kokusai, LAM, Lam Research, Leica, Lintec, Loomis, Lumonics, Mactronix, Matsushita, Mech-El, Micro Automation, MRC, MTI, Nanometrics, Nitto, OAI, Olympus, Oriel, Oxford, Perkin Elmer, PRI, Prometrix, Recif SA, Rucker & Kolls, Suss MicroTec, SVG, Takatori, Tegal, Tencor, Tropel, Ultracision, Ultratech, Ulvac, Veeco, Verteq, Wentworth, Xynetics
The main model MPASeries, CDS-650CT, PLA-501F, MA-4100, NSR-1505G4, 1000, Titan II, MA150, 6033, 2029,2020,2025, 6200Series, SM200E, Step 200,UM810, UH-130, UF3000 EX, SFX100, M777, FPA-5500iZa, SR8220-019, Desktop 1, 270 SRD, ST-260, 1600-55, 8100XP, 8100Series, 1H-DX, KP-4200, MA-4201Series, MA-1006, L200,UH130M,DFM-M150, CEE 100, SP323, MJB3Series, JWSSeries, MA6Series, SWC4000, EX-5700, 2001X, MDA-60FA, 680A, 8300, ARM200CF, S-5200, S-4700, AS5000, Axiotron II, INS330, Axiospect 301, SF 600, WaferMark II,3308, MASeries, 20T2/150VPO, 860, 1600-55A, UH 102, 4000, Eureka 450, ETI0392A-6-U, 425130, ETII-6910B-X-V, EET1-0395D-X-U, ETII-6910B-X-V, F-6225, 827, 907, 211,UVSeries, AIT8010, eCD2, 8100XPR, CD-SEMSeries, 8250, PC 4400, 300405, SFS 6420, 6D, MM-Cascade 6100, MJB-55, 179884/ P-2 OPEN FRAME, 8300X, 4500, ATRM-2100, SWC11, MAS-8000,ATM-1100E, 3A, 90, RTP-600xp, UKA-650, SPP8, MP 2300, BH-BHM, 2066,AL100-L8, IDLW8R, REL-4500, IDLW8R, MAS-8000, Fix Load25, UKA-825, SCW111, ATRM-2100D, 4055/2, Optistation 3, REL-4500, ResMap 178, 8097, 1600-55m, LSD 100, DSL 10, H100, RHM-06, 908, UH-130, 600W, 100FX, RS 35, P16+, 8620, MA8/BA8 Gen3, lle-855SS, 85DD, SFS7700, 2300 Versys, ZX-1000, Mark7, S-7800HSA, 5610,ES3, M-GAUGE 200, AITI,SFS7200, THERMA-WAVE OP 2600, MA150, 2115, 9400, NGP80, 620, XRF3640, CTR-200, TREX 610, F-4225, EET10395-4-U, SYO-200SS, MS100, RS-75, 7400/18, 2001X 6, PLA-501FA, PS300 Parametric Serie 12, DX-III, SHS 1000VAC, V300-Si, 12", WM650, AlphaStep 300, SURFSCAN 7700, 903eSeries, F6000QS, SP1 TB1, Nanolab 600, NWL860-TMB-SP, F5, DSS200, RS35C, MX-50, DD-823V-8BL, MicroSense 6300, 2400, 4400,E5200, 8108, 600FA, 40, MRC 603, 7700, VersaPort 2200, R-3, SSEC M10, ST-270 SRD, L3510, HTC 8020, Lumonics III, 1800-6AR, HTC 4000, SSW-60A-AR, 1034X, WST 306, ST-860, KIS 2000, L3510E, 9350, PSM 6, 80B, RS-35, DR-8500 II, 301, VLR RIE LM/TM, 20T2/150VPO, 1034 XA – 6, 4085XSeries, 682A, 500R 120-1007, E8025S, 100 RIE, M6000L, EV CS50, 150, RC8, ATM-105-1-S-CE-S293, MPC3000, DMI4000B, 5100, F5x, P-10, LP-200H, F200, CMS1030, CW1002-6200RW, 8860, APM90A, 3001X, APM5000, 880
HS Code 8486 10 10 for Apparatus for rapid heating of semiconductor wafers.
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devicesde8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices