Used Wafer Equipment
403 resultseS32 e-beam wafer inspection 200mm Condition Fair Serial Number(s) 2032 Year(s) : 2006 Location : EUROPE (Western and Northern)
Price : On request
More detailsDetails: - Semi-Automated Spray Solvent Tool (SST) - Batch Solvent Processor for Wafer Cleaning - Max Substrat Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsDescription: Other Information Wafer Size: 4 to 8" Tape Tension: Programmable Cycle Time: 30 seconds for a 6 Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsUser Manual available Location : EUROPE (Western and Northern)
Price : On request
More detailsExSolve CLM next Gen, 300mm Microscope Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details382 AUTO FILM FRAME MOUNTER (BONDER) INCLUDES QTY 25 6″ FILM FRAMES Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsManual Aligner Year(s) : 2007 Location : ASIA (North East)
Price : On request
More detailsAlpha Step IQ Year(s) : 2013 Location : ASIA (North East)
Price : On request
More detailsWafer Size Range Minimum 50 mm Maximum 100 mm Set Size 100 mm Other Information Chucks:2"-3"-4" Po Location : AMERICA North (USA-Canada-Mexico)
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More detailsWafer Size Range Minimum 50 mm Maximum 200 mm Set Size 100 mm Mask Plate Size 5'' x 5'' Alignment Year(s) : 2001 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsImplant Dose Measurement Condition Very Good Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsThe Model UH101 Semiautomatic UV Curing System has all of the features of its larger fully automated sibling, Location : AMERICA North (USA-Canada-Mexico)
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More detailsVersion: 200 mm Vintage: 01.06.2005 WaferStorm Wet Processing Platform The WaferStorm platform is the indus Year(s) : 2005 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsAligner: Semi-Automated Bottom Sude Mask Aligner Year(s) : 2017 Location : ASIA (North East)
Price : On request
More details1000 WATT POWER SUPPLY 1 MICRON RESOLUTION ON 6″ WAFERS SPLIT FIELD MICROSCOPE WITH 6 OBJECTIVES Similar to K& Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details2” to 6” (dia.) Wafer Capability Sheet Resistance Range: 1.1 mΩ/sq to 450 KΩ/sq Slice Resistivity Range: 4.19 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsManufacturer: Bondztek Model: Bondztek Wafer Mount Wafer Ring Mounter to foton ring Location : EUROPE (Western and Northern)
Price : On request
More detailsDescription: Exhaust management gas scrubber BOC EDWARDS BOC EDWARDS Longdescription: Equipment Details: Ex Year(s) : 2004 Location : EUROPE (Western and Northern)
Price : On request
More detailsWafer Inspection Microscope Version: 300 mm Year(s) : 2011 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details- 8" Configured (can change to 6") - Quartz plasma tube and baffles - ASTEX Microwave 1.2kw - Temperature Cont Location : ASIA (North East)
Price : On request
More detailsConfiguration: Configured as shown in pictures. Details coming soon ! Tester interface is not included. Teste Year(s) : 2005 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsMicroscope Type Upright Microscope Configuration Brightfield, Darkfield & DIC Illumination Type Reflected L Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsExterior Dimensions Width 40.157 in (102.0 cm) Depth 44.094 in (112.0 cm) Height 59.055 in (1 Year(s) : 2017 Location : EUROPE (Western and Northern)
Price : On request
More details[ General Description ] Wafer Size : 2 ~8 inch Illumination Source : 8mW laser, 635 nm wavelength Operator Int Year(s) : 2006 Location : ASIA (North East)
Price : On request
More detailsBackside Laser Ablation Tool Cassette to Cassette YES Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsYou can find used Wafer Equipment on Wotol
The main manufacturers of Wafer Equipment are KLA-Tencor, Karl Suss, Canon, Electroglas, Suss, Nikon, Semitool, TEL, Tokyo Semitsu Kogaku (TSK), Branson / IPC, MGI, Ultron, EVG, Allwin21, Abm, Accretech, ADE, AG Associates, AIO, Alessi, Applied Materials, ASM, ASML, Asyst Technologies, ATMI, Axcelis, Brooks Automation, Buehler, Cambridge, Cascade, Cascade Microtech, CDE (Creative Design Engineering), CEE, CHA, Control Micro Systems (CMS), Cymer, Dainippon Screen,Dektak, Denton, Disco, DNK, DNS, Dynapert, Dynatex, Electroglass, EV Group, Evergreen, Faith, Fluoroware, Fortrend Engineering, Gasonics, GCA, GSI Lumonics, Hitachi, HTG, IMT, InspecTech, Ionic Systems, Jeol, K & S, Kensington, KLA, Kokusai, LAM, Lam Research, Leica, Lintec, Loomis, Lumonics, Mactronix, Matsushita, Mech-El, Micro Automation, MRC, MTI, Nanometrics, Nitto, OAI, Olympus, Oriel, Oxford, Perkin Elmer, PRI, Prometrix, Recif SA, Rucker & Kolls, Suss MicroTec, SVG, Takatori, Tegal, Tencor, Tropel, Ultracision, Ultratech, Ulvac, Veeco, Verteq, Wentworth, Xynetics
The main model MPASeries, CDS-650CT, PLA-501F, MA-4100, NSR-1505G4, 1000, Titan II, MA150, 6033, 2029,2020,2025, 6200Series, SM200E, Step 200,UM810, UH-130, UF3000 EX, SFX100, M777, FPA-5500iZa, SR8220-019, Desktop 1, 270 SRD, ST-260, 1600-55, 8100XP, 8100Series, 1H-DX, KP-4200, MA-4201Series, MA-1006, L200,UH130M,DFM-M150, CEE 100, SP323, MJB3Series, JWSSeries, MA6Series, SWC4000, EX-5700, 2001X, MDA-60FA, 680A, 8300, ARM200CF, S-5200, S-4700, AS5000, Axiotron II, INS330, Axiospect 301, SF 600, WaferMark II,3308, MASeries, 20T2/150VPO, 860, 1600-55A, UH 102, 4000, Eureka 450, ETI0392A-6-U, 425130, ETII-6910B-X-V, EET1-0395D-X-U, ETII-6910B-X-V, F-6225, 827, 907, 211,UVSeries, AIT8010, eCD2, 8100XPR, CD-SEMSeries, 8250, PC 4400, 300405, SFS 6420, 6D, MM-Cascade 6100, MJB-55, 179884/ P-2 OPEN FRAME, 8300X, 4500, ATRM-2100, SWC11, MAS-8000,ATM-1100E, 3A, 90, RTP-600xp, UKA-650, SPP8, MP 2300, BH-BHM, 2066,AL100-L8, IDLW8R, REL-4500, IDLW8R, MAS-8000, Fix Load25, UKA-825, SCW111, ATRM-2100D, 4055/2, Optistation 3, REL-4500, ResMap 178, 8097, 1600-55m, LSD 100, DSL 10, H100, RHM-06, 908, UH-130, 600W, 100FX, RS 35, P16+, 8620, MA8/BA8 Gen3, lle-855SS, 85DD, SFS7700, 2300 Versys, ZX-1000, Mark7, S-7800HSA, 5610,ES3, M-GAUGE 200, AITI,SFS7200, THERMA-WAVE OP 2600, MA150, 2115, 9400, NGP80, 620, XRF3640, CTR-200, TREX 610, F-4225, EET10395-4-U, SYO-200SS, MS100, RS-75, 7400/18, 2001X 6, PLA-501FA, PS300 Parametric Serie 12, DX-III, SHS 1000VAC, V300-Si, 12", WM650, AlphaStep 300, SURFSCAN 7700, 903eSeries, F6000QS, SP1 TB1, Nanolab 600, NWL860-TMB-SP, F5, DSS200, RS35C, MX-50, DD-823V-8BL, MicroSense 6300, 2400, 4400,E5200, 8108, 600FA, 40, MRC 603, 7700, VersaPort 2200, R-3, SSEC M10, ST-270 SRD, L3510, HTC 8020, Lumonics III, 1800-6AR, HTC 4000, SSW-60A-AR, 1034X, WST 306, ST-860, KIS 2000, L3510E, 9350, PSM 6, 80B, RS-35, DR-8500 II, 301, VLR RIE LM/TM, 20T2/150VPO, 1034 XA – 6, 4085XSeries, 682A, 500R 120-1007, E8025S, 100 RIE, M6000L, EV CS50, 150, RC8, ATM-105-1-S-CE-S293, MPC3000, DMI4000B, 5100, F5x, P-10, LP-200H, F200, CMS1030, CW1002-6200RW, 8860, APM90A, 3001X, APM5000, 880
HS Code 8486 10 10 for Apparatus for rapid heating of semiconductor wafers.
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devicesde8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices