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Used Wafer Equipment

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1

Aligner Location : ASIA (North East)

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Aligner: Mask Year(s) : 2002 Location : ASIA (North East)

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Other: Autocollimator Location : ASIA (North East)

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• Type: Automatic motor-driven wafer film laminator • Lamination Method: One-pass uniform film lamination • La Location : AMERICA North (USA-Canada-Mexico)

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• Wafer Size: up to 200 mm (8”) • Probe Station Type: Manual, high-precision • Measurement Environment: – Inte Location : AMERICA North (USA-Canada-Mexico)

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Fire retardant polypropalene construction High purity PVDF plumbing and teflon valves PFA teflon spray guns fo Location : AMERICA North (USA-Canada-Mexico)

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The spin rinse dryer is used for rinsing and drying substrates. A safety emergency stop for the nitrogen heate Year(s) : 2015 Location : EUROPE (Western and Northern)

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The Spin Rinse Dryer is used for rinsing and drying substrates. Max. size: 8" low profile, NOT Aus on the fro Year(s) : 2017 Location : EUROPE (Western and Northern)

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SussMicrotec Mask Aligner MA 150e Remanufactured Automatic Mask Aligner System, Configuration: Suss MA 100/15 Year(s) : 2010 Location : EUROPE (Western and Northern)

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Description: Exhaust management gas scrubber BOC EDWARDS BOC EDWARDS Longdescription: Equipment Details: Ex Year(s) : 2004 Location : EUROPE (Western and Northern)

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Wafer sorter for 300mm wafer Version: 300mm De-installed, warehoused. Can be inspected by appointment. 2 port Location : ASIA (South East)

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Specifications Applicable Frame Size: 8"/6" Applicable Wafer Size: 8"/6" Applicable Wafer Thickness: 200µm or Location : ASIA (North East)

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Precision P5000 Platform Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Cassette to Year(s) : 2001 Location : EUROPE (Western and Northern)

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VOLLAUTOM. FOLIERANLAGE, NITTO - DR - 8500 / PFM3 Wafer Size Range Minimum 150 mm Maximum 200 mm Set Year(s) : 2000 Location : EUROPE (Western and Northern)

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Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Accessories Spare parts list: see Year(s) : 2015 Location : EUROPE (Western and Northern)

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Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Condition Very Good Year of Manufac Year(s) : 2000 Location : EUROPE (Western and Northern)

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Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Cassette to Cassette YES Accessori Year(s) : 1998 Location : EUROPE (Western and Northern)

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Precision P5000 Platform Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 150 mm Cassette to Location : EUROPE (Western and Northern)

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Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Accessories Spare parts list: see Year(s) : 2001 Location : EUROPE (Western and Northern)

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Manufacturer Microcontrol Model PFP 6 Description PFP 6 Detaper 408 Wafer Size Range Minimum 150 mm Year(s) : 2003 Location : EUROPE (Western and Northern)

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Accessories Spare parts list: see Excel file Robot handler - original (carbon) Motor for SC1 spincup Extend Year(s) : 2009 Location : EUROPE (Western and Northern)

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31

Mask and Wafer Inspection Loadport : 300mm x 2 Sets DualFIMS Working Condition. Wafer : 300 mm Complete. Year(s) : 2007 Location : ASIA (North East)

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Condition Poor Exterior Dimensions Width 33.465 in (85.0 cm) Depth 52.992 in (134.6 cm) Height 39.7 Year(s) : 1999 Location : EUROPE (Western and Northern)

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FLUOROCARBON RD4500 CLASSIC Description: SRD Version: 100 mm Year(s) : 1986 Location : AMERICA North (USA-Canada-Mexico)

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Atmospheric wafer robot( Ebara Frex 300 CMP) Version: 30 0mm Location : AMERICA North (USA-Canada-Mexico)

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You can find used Wafer Equipment on Wotol

The main manufacturers of Wafer Equipment are KLA-Tencor, Karl Suss, Canon, Electroglas, Suss, Nikon, Semitool, TEL, Tokyo Semitsu Kogaku (TSK), Branson / IPC, MGI, Ultron, EVG, Allwin21, Abm, Accretech, ADE, AG Associates, AIO, Alessi, Applied Materials, ASM, ASML, Asyst Technologies, ATMI, Axcelis, Brooks Automation, Buehler, Cambridge, Cascade, Cascade Microtech, CDE (Creative Design Engineering), CEE, CHA, Control Micro Systems (CMS), Cymer, Dainippon Screen,Dektak, Denton, Disco, DNK, DNS, Dynapert, Dynatex, Electroglass, EV Group, Evergreen, Faith, Fluoroware, Fortrend Engineering, Gasonics, GCA, GSI Lumonics, Hitachi, HTG, IMT, InspecTech, Ionic Systems, Jeol, K & S, Kensington, KLA, Kokusai, LAM, Lam Research, Leica, Lintec, Loomis, Lumonics, Mactronix, Matsushita, Mech-El, Micro Automation, MRC, MTI, Nanometrics, Nitto, OAI, Olympus, Oriel, Oxford, Perkin Elmer, PRI, Prometrix, Recif SA, Rucker & Kolls, Suss MicroTec, SVG, Takatori, Tegal, Tencor, Tropel, Ultracision, Ultratech, Ulvac, Veeco, Verteq, Wentworth, Xynetics

The main model  MPASeries, CDS-650CT, PLA-501F, MA-4100, NSR-1505G4, 1000, Titan II, MA150,  6033, 2029,2020,2025, 6200Series, SM200E, Step 200,UM810, UH-130, UF3000 EX, SFX100, M777, FPA-5500iZa, SR8220-019, Desktop 1, 270 SRD, ST-260, 1600-55, 8100XP, 8100Series, 1H-DX, KP-4200, MA-4201Series, MA-1006, L200,UH130M,DFM-M150, CEE 100, SP323, MJB3Series, JWSSeries, MA6Series, SWC4000, EX-5700, 2001X, MDA-60FA, 680A, 8300, ARM200CF, S-5200, S-4700, AS5000, Axiotron II, INS330, Axiospect 301, SF 600, WaferMark II,3308, MASeries, 20T2/150VPO, 860, 1600-55A, UH 102, 4000, Eureka 450, ETI0392A-6-U, 425130, ETII-6910B-X-V, EET1-0395D-X-U, ETII-6910B-X-V, F-6225, 827, 907, 211,UVSeries, AIT8010, eCD2, 8100XPR, CD-SEMSeries, 8250, PC 4400, 300405, SFS 6420, 6D, MM-Cascade 6100, MJB-55, 179884/ P-2 OPEN FRAME, 8300X, 4500, ATRM-2100, SWC11, MAS-8000,ATM-1100E, 3A, 90, RTP-600xp, UKA-650, SPP8, MP 2300, BH-BHM, 2066,AL100-L8, IDLW8R, REL-4500, IDLW8R, MAS-8000, Fix Load25, UKA-825, SCW111, ATRM-2100D, 4055/2, Optistation 3, REL-4500, ResMap 178, 8097, 1600-55m, LSD 100, DSL 10, H100, RHM-06, 908, UH-130, 600W, 100FX, RS 35, P16+, 8620, MA8/BA8 Gen3, lle-855SS, 85DD, SFS7700, 2300 Versys, ZX-1000, Mark7, S-7800HSA, 5610,ES3, M-GAUGE 200, AITI,SFS7200, THERMA-WAVE OP 2600, MA150, 2115, 9400, NGP80, 620, XRF3640, CTR-200, TREX 610, F-4225, EET10395-4-U, SYO-200SS, MS100, RS-75, 7400/18, 2001X 6, PLA-501FA, PS300 Parametric Serie 12, DX-III, SHS 1000VAC, V300-Si, 12", WM650, AlphaStep 300, SURFSCAN 7700, 903eSeries, F6000QS, SP1 TB1, Nanolab 600, NWL860-TMB-SP, F5, DSS200, RS35C, MX-50, DD-823V-8BL, MicroSense 6300, 2400, 4400,E5200, 8108, 600FA, 40, MRC 603, 7700, VersaPort 2200, R-3, SSEC M10, ST-270 SRD, L3510, HTC 8020, Lumonics III, 1800-6AR, HTC 4000, SSW-60A-AR, 1034X, WST 306, ST-860, KIS 2000, L3510E, 9350, PSM 6, 80B, RS-35, DR-8500 II, 301, VLR RIE LM/TM, 20T2/150VPO, 1034 XA – 6, 4085XSeries, 682A, 500R 120-1007, E8025S, 100 RIE, M6000L, EV CS50, 150, RC8, ATM-105-1-S-CE-S293, MPC3000, DMI4000B, 5100, F5x, P-10, LP-200H, F200, CMS1030, CW1002-6200RW, 8860, APM90A, 3001X, APM5000, 880

HS Code 8486 10 10 for Apparatus for rapid heating of semiconductor wafers. 
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devicesde8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices

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