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Used Wafer Equipment

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1

MidCurrent Implanter Condition Good Year of Manufacture 2002 Power Requirements 208 V CE Marked YES Year(s) : 2002 Location : EUROPE (Western and Northern)

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Wafer Size Range Minimum 150 mm Maximum 300 mm Set Size 300 mm Number of Robots 1 Position 1 Tank M Year(s) : 2016 Location : EUROPE (Western and Northern)

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TWS-M3111 Software Version TWS-M3111 Electric Schematic Number 81152323 Condition Very Good Power Requirement Year(s) : 2011 Location : EUROPE (Western and Northern)

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Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 150 mm Robot Manufacturer/Model Genmark C Year(s) : 1996 Location : EUROPE (Western and Northern)

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P5000 17 Main Frame Only Condition Very Good Year(s) : 2007 Location : EUROPE (Western and Northern)

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Mounter Wafer Size Range Set Size 200 mm Condition Good Year(s) : 1996 Location : EUROPE (Western and Northern)

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Defolieranlage Condition Very Good Power Requirements Other V 50 Hz 3 Phase Year(s) : 2011 Location : EUROPE (Western and Northern)

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De-foiling system Wafer Size Range Set Size 150 mm Condition Good Power Requirements 230 V 50.0 A Year(s) : 2007 Location : EUROPE (Western and Northern)

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WSS Glass Demount Wafer Size Range Set Size 200 mm Condition Very Good Year(s) : 2014 Location : EUROPE (Western and Northern)

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Condition Good Power Requirements 220 V 24.0 A 15.0 A(2) 50 Hz 3 Phase Year(s) : 2008 Location : EUROPE (Western and Northern)

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WAFER SPECIFICATION Wafer Size 150mm SYSTEM CONFIGURATION CHAMBER A CHAMBER B Year(s) : 2007 Location : EUROPE (Western and Northern)

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Currently tool is still warm down Condition Good Year of Manufacture 2006 Year(s) : 2006 Location : EUROPE (Western and Northern)

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Detaping 6" thinwafer Wafer Size Range Minimum 200 mm Maximum 200 mm Set Size 200 mm Cassette to Ca Year(s) : 2006 Location : EUROPE (Western and Northern)

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eS32 e-beam wafer inspection 200mm Condition Fair Serial Number(s) 2032 Year(s) : 2006 Location : EUROPE (Western and Northern)

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User Manual available Location : EUROPE (Western and Northern)

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NIDEC SANKYO Corporation Condition Good Weight 1,433 lb (650 kg) Serial Number(s) FR00891253 Year(s) : 2008 Location : EUROPE (Western and Northern)

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Sawed Wafer Cleaner - 6" Power Requirements 115 V 5.0 A 60 Hz 1 Phase Exterior Dimensions Width 30.000 in (7 Location : AMERICA North (USA-Canada-Mexico)

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Description Load Port - 300mm Location : AMERICA North (USA-Canada-Mexico)

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• Infinity Corrected Objectives: Yes • Illumination Voltage: 12 V • Illumination Power: 100 W • Power Supply I Location : AMERICA North (USA-Canada-Mexico)

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Substrate Size Up to 100mm Wafer Size Range Maximum 100 mm Controller Type Microprocessor Controller Type Con Location : AMERICA North (USA-Canada-Mexico)

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Fire retardant polypropalene construction High purity PVDF plumbing and teflon valves PFA teflon spray guns fo Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Maximum 200 mm Cassettes per Load 2 Controller Type Microprocessor Controller Type Ex Year(s) : 1995 Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Maximum 100 mm Microscope Type Microzoom Multiple Objectives Models Bausch & Lomb Ind Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Set Size 150 mm Wafer Handling Manual Vacuum Chuck Diameter 6.1811 in (157.00 mm Location : AMERICA North (USA-Canada-Mexico)

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Substrate Size 75mm Wafer Size Range Maximum 75 mm Controller Type Microprocessor Controller Type Contr Location : AMERICA North (USA-Canada-Mexico)

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You can find used Wafer Equipment on Wotol

The main manufacturers of Wafer Equipment are KLA-Tencor, Karl Suss, Canon, Electroglas, Suss, Nikon, Semitool, TEL, Tokyo Semitsu Kogaku (TSK), Branson / IPC, MGI, Ultron, EVG, Allwin21, Abm, Accretech, ADE, AG Associates, AIO, Alessi, Applied Materials, ASM, ASML, Asyst Technologies, ATMI, Axcelis, Brooks Automation, Buehler, Cambridge, Cascade, Cascade Microtech, CDE (Creative Design Engineering), CEE, CHA, Control Micro Systems (CMS), Cymer, Dainippon Screen,Dektak, Denton, Disco, DNK, DNS, Dynapert, Dynatex, Electroglass, EV Group, Evergreen, Faith, Fluoroware, Fortrend Engineering, Gasonics, GCA, GSI Lumonics, Hitachi, HTG, IMT, InspecTech, Ionic Systems, Jeol, K & S, Kensington, KLA, Kokusai, LAM, Lam Research, Leica, Lintec, Loomis, Lumonics, Mactronix, Matsushita, Mech-El, Micro Automation, MRC, MTI, Nanometrics, Nitto, OAI, Olympus, Oriel, Oxford, Perkin Elmer, PRI, Prometrix, Recif SA, Rucker & Kolls, Suss MicroTec, SVG, Takatori, Tegal, Tencor, Tropel, Ultracision, Ultratech, Ulvac, Veeco, Verteq, Wentworth, Xynetics

The main model  MPASeries, CDS-650CT, PLA-501F, MA-4100, NSR-1505G4, 1000, Titan II, MA150,  6033, 2029,2020,2025, 6200Series, SM200E, Step 200,UM810, UH-130, UF3000 EX, SFX100, M777, FPA-5500iZa, SR8220-019, Desktop 1, 270 SRD, ST-260, 1600-55, 8100XP, 8100Series, 1H-DX, KP-4200, MA-4201Series, MA-1006, L200,UH130M,DFM-M150, CEE 100, SP323, MJB3Series, JWSSeries, MA6Series, SWC4000, EX-5700, 2001X, MDA-60FA, 680A, 8300, ARM200CF, S-5200, S-4700, AS5000, Axiotron II, INS330, Axiospect 301, SF 600, WaferMark II,3308, MASeries, 20T2/150VPO, 860, 1600-55A, UH 102, 4000, Eureka 450, ETI0392A-6-U, 425130, ETII-6910B-X-V, EET1-0395D-X-U, ETII-6910B-X-V, F-6225, 827, 907, 211,UVSeries, AIT8010, eCD2, 8100XPR, CD-SEMSeries, 8250, PC 4400, 300405, SFS 6420, 6D, MM-Cascade 6100, MJB-55, 179884/ P-2 OPEN FRAME, 8300X, 4500, ATRM-2100, SWC11, MAS-8000,ATM-1100E, 3A, 90, RTP-600xp, UKA-650, SPP8, MP 2300, BH-BHM, 2066,AL100-L8, IDLW8R, REL-4500, IDLW8R, MAS-8000, Fix Load25, UKA-825, SCW111, ATRM-2100D, 4055/2, Optistation 3, REL-4500, ResMap 178, 8097, 1600-55m, LSD 100, DSL 10, H100, RHM-06, 908, UH-130, 600W, 100FX, RS 35, P16+, 8620, MA8/BA8 Gen3, lle-855SS, 85DD, SFS7700, 2300 Versys, ZX-1000, Mark7, S-7800HSA, 5610,ES3, M-GAUGE 200, AITI,SFS7200, THERMA-WAVE OP 2600, MA150, 2115, 9400, NGP80, 620, XRF3640, CTR-200, TREX 610, F-4225, EET10395-4-U, SYO-200SS, MS100, RS-75, 7400/18, 2001X 6, PLA-501FA, PS300 Parametric Serie 12, DX-III, SHS 1000VAC, V300-Si, 12", WM650, AlphaStep 300, SURFSCAN 7700, 903eSeries, F6000QS, SP1 TB1, Nanolab 600, NWL860-TMB-SP, F5, DSS200, RS35C, MX-50, DD-823V-8BL, MicroSense 6300, 2400, 4400,E5200, 8108, 600FA, 40, MRC 603, 7700, VersaPort 2200, R-3, SSEC M10, ST-270 SRD, L3510, HTC 8020, Lumonics III, 1800-6AR, HTC 4000, SSW-60A-AR, 1034X, WST 306, ST-860, KIS 2000, L3510E, 9350, PSM 6, 80B, RS-35, DR-8500 II, 301, VLR RIE LM/TM, 20T2/150VPO, 1034 XA – 6, 4085XSeries, 682A, 500R 120-1007, E8025S, 100 RIE, M6000L, EV CS50, 150, RC8, ATM-105-1-S-CE-S293, MPC3000, DMI4000B, 5100, F5x, P-10, LP-200H, F200, CMS1030, CW1002-6200RW, 8860, APM90A, 3001X, APM5000, 880

HS Code 8486 10 10 for Apparatus for rapid heating of semiconductor wafers. 
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devicesde8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices

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