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Used Wafer Equipment

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1

wafer 200mm as-is complete working condition Location : ASIA (China - Taiwan - HKG)

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wafer size: 4/5/6/8 inch Applicable wafer thickness: 300-1000um Power supply: 110V fully refurbished, all func Location : ASIA (China - Taiwan - HKG)

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MA150CC MANUAL TOPSIDE ALIGNER WAFER SIZE: 150MM Location : ASIA (China - Taiwan - HKG)

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WAFER SIZE: 150MM Location : ASIA (China - Taiwan - HKG)

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MARK V TRACK 2 Coat 2 Dev As-Is wafer size: 150mm Year(s) : 1997 Location : ASIA (China - Taiwan - HKG)

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Inspection: wafer Year(s) : 2008 Location : ASIA (North East)

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1C2D +WEE condition: as-is wafer size: 150mm Year(s) : 1997 Location : ASIA (China - Taiwan - HKG)

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3290 Location : ASIA (China - Taiwan - HKG)

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RS-55TCA -REFURBISHED CONDITION -SOFTWARE: DOS VERSION Year(s) : 1995 Location : ASIA (China - Taiwan - HKG)

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Wafer Size: 150mm Location : AMERICA North (USA-Canada-Mexico)

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4400 series sputtering tool Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size: 150mm Location : AMERICA North (USA-Canada-Mexico)

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Microscope: Quick Vision System Location : ASIA (North East)

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Vacuum Chuck Diameter 5.9055 in (150.00 mm) Plating Material Stainless steel Description Analytical Location : AMERICA North (USA-Canada-Mexico)

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- Configured for Top Side Alignment - Includes one Chuck (Customer to Choose Size) - Includes one Maskholder ( Location : AMERICA North (USA-Canada-Mexico)

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MA 150C Mask aligner TSA Top Side Only Wafer Size: 150mm Location : AMERICA North (USA-Canada-Mexico)

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Aligner/5in. Location : ASIA (North East)

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2300 Exelan Flex EX+ Year(s) : 2011 Location : ASIA (North East)

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Exterior Dimensions Width 9.500 in (24.1 cm) Depth 9.500 in (24.1 cm) Height 18.000 in (45.7 Location : AMERICA North (USA-Canada-Mexico)

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Single Rinse/Dryer w/ TC20, 328 controller S/N C8249 Location : AMERICA North (USA-Canada-Mexico)

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TELIUS Wafer Size 12 Year(s) : 2004 Location : ASIA (North East)

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μ-Asher Wafer Size 8 Location : ASIA (North East)

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Unity lle 85DI Wafer Size 8 Year(s) : 1998 Location : ASIA (North East)

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Unity ME 85 SCCM Year(s) : 2005 Location : ASIA (North East)

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IINDY-B-L Wafer Size 300 Year(s) : 2006 Location : ASIA (North East)

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You can find used Wafer Equipment on Wotol

The main manufacturers of Wafer Equipment are KLA-Tencor, Karl Suss, Canon, Electroglas, Suss, Nikon, Semitool, TEL, Tokyo Semitsu Kogaku (TSK), Branson / IPC, MGI, Ultron, EVG, Allwin21, Abm, Accretech, ADE, AG Associates, AIO, Alessi, Applied Materials, ASM, ASML, Asyst Technologies, ATMI, Axcelis, Brooks Automation, Buehler, Cambridge, Cascade, Cascade Microtech, CDE (Creative Design Engineering), CEE, CHA, Control Micro Systems (CMS), Cymer, Dainippon Screen,Dektak, Denton, Disco, DNK, DNS, Dynapert, Dynatex, Electroglass, EV Group, Evergreen, Faith, Fluoroware, Fortrend Engineering, Gasonics, GCA, GSI Lumonics, Hitachi, HTG, IMT, InspecTech, Ionic Systems, Jeol, K & S, Kensington, KLA, Kokusai, LAM, Lam Research, Leica, Lintec, Loomis, Lumonics, Mactronix, Matsushita, Mech-El, Micro Automation, MRC, MTI, Nanometrics, Nitto, OAI, Olympus, Oriel, Oxford, Perkin Elmer, PRI, Prometrix, Recif SA, Rucker & Kolls, Suss MicroTec, SVG, Takatori, Tegal, Tencor, Tropel, Ultracision, Ultratech, Ulvac, Veeco, Verteq, Wentworth, Xynetics

The main model  MPASeries, CDS-650CT, PLA-501F, MA-4100, NSR-1505G4, 1000, Titan II, MA150,  6033, 2029,2020,2025, 6200Series, SM200E, Step 200,UM810, UH-130, UF3000 EX, SFX100, M777, FPA-5500iZa, SR8220-019, Desktop 1, 270 SRD, ST-260, 1600-55, 8100XP, 8100Series, 1H-DX, KP-4200, MA-4201Series, MA-1006, L200,UH130M,DFM-M150, CEE 100, SP323, MJB3Series, JWSSeries, MA6Series, SWC4000, EX-5700, 2001X, MDA-60FA, 680A, 8300, ARM200CF, S-5200, S-4700, AS5000, Axiotron II, INS330, Axiospect 301, SF 600, WaferMark II,3308, MASeries, 20T2/150VPO, 860, 1600-55A, UH 102, 4000, Eureka 450, ETI0392A-6-U, 425130, ETII-6910B-X-V, EET1-0395D-X-U, ETII-6910B-X-V, F-6225, 827, 907, 211,UVSeries, AIT8010, eCD2, 8100XPR, CD-SEMSeries, 8250, PC 4400, 300405, SFS 6420, 6D, MM-Cascade 6100, MJB-55, 179884/ P-2 OPEN FRAME, 8300X, 4500, ATRM-2100, SWC11, MAS-8000,ATM-1100E, 3A, 90, RTP-600xp, UKA-650, SPP8, MP 2300, BH-BHM, 2066,AL100-L8, IDLW8R, REL-4500, IDLW8R, MAS-8000, Fix Load25, UKA-825, SCW111, ATRM-2100D, 4055/2, Optistation 3, REL-4500, ResMap 178, 8097, 1600-55m, LSD 100, DSL 10, H100, RHM-06, 908, UH-130, 600W, 100FX, RS 35, P16+, 8620, MA8/BA8 Gen3, lle-855SS, 85DD, SFS7700, 2300 Versys, ZX-1000, Mark7, S-7800HSA, 5610,ES3, M-GAUGE 200, AITI,SFS7200, THERMA-WAVE OP 2600, MA150, 2115, 9400, NGP80, 620, XRF3640, CTR-200, TREX 610, F-4225, EET10395-4-U, SYO-200SS, MS100, RS-75, 7400/18, 2001X 6, PLA-501FA, PS300 Parametric Serie 12, DX-III, SHS 1000VAC, V300-Si, 12", WM650, AlphaStep 300, SURFSCAN 7700, 903eSeries, F6000QS, SP1 TB1, Nanolab 600, NWL860-TMB-SP, F5, DSS200, RS35C, MX-50, DD-823V-8BL, MicroSense 6300, 2400, 4400,E5200, 8108, 600FA, 40, MRC 603, 7700, VersaPort 2200, R-3, SSEC M10, ST-270 SRD, L3510, HTC 8020, Lumonics III, 1800-6AR, HTC 4000, SSW-60A-AR, 1034X, WST 306, ST-860, KIS 2000, L3510E, 9350, PSM 6, 80B, RS-35, DR-8500 II, 301, VLR RIE LM/TM, 20T2/150VPO, 1034 XA – 6, 4085XSeries, 682A, 500R 120-1007, E8025S, 100 RIE, M6000L, EV CS50, 150, RC8, ATM-105-1-S-CE-S293, MPC3000, DMI4000B, 5100, F5x, P-10, LP-200H, F200, CMS1030, CW1002-6200RW, 8860, APM90A, 3001X, APM5000, 880

HS Code 8486 10 10 for Apparatus for rapid heating of semiconductor wafers. 
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devicesde8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices

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