Used Bonder
334 resultsDie Bonder Model AD838L Location : EUROPE (Western and Northern)
Price : On request
More detailsgood condition Year(s) : 2005 Location : EUROPE (Western and Northern)
Price : On request
More detailsWire Bonder 45° Bondhead Vintage 2014 Year(s) : 2014 Location : EUROPE (Western and Northern)
Price : On request
More detailsIncluded 3 monitors Condition Good Year(s) : 2004 Location : EUROPE (Western and Northern)
Price : On request
More detailsWest Bond 353637E-90 Automatic, Gantry, Large Area, Triple-Convertible Wire Bonder. Currently configured for Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsCondition Refurbished Heated bondhead Wafer strecher Flip unit Tool bank Year(s) : 2012 Location : EUROPE (Western and Northern)
Price : On request
More detailsAccessories 3 monitors Condition Good Year of Manufacture 2008 Year(s) : 2008 Location : EUROPE (Western and Northern)
Price : On request
More detailsWIRE BONDER Accessories Monitors Year of Manufacture 2003 Condition Good Year(s) : 2003 Location : EUROPE (Western and Northern)
Price : On request
More detailsCondition Good Year(s) : 2004 Location : EUROPE (Western and Northern)
Price : On request
More details- 50/60 Hz - 220 V 2019 Vintage Year(s) : 2019 Location : EUROPE (Western and Northern)
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More detailsThe Hesse & Knipps Bondjet 710/810 series of automatic wedge bonders covers all applications using gold, alum Location : EUROPE (Western and Northern)
Price : On request
More detailsThe iBond5000-Ball is an advanced ball bonder used for process development, production, research, or added man Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWEST BOND 454647E-79 Semiautomatic Convertible Ball Wire Bonder Microprocessor controlled motor drives for bot Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsAccessories Monitors Year of Manufacture 2006 Condition Good Year(s) : 2006 Location : EUROPE (Western and Northern)
Price : On request
More detailsKARL SUSS MA150CC MASK ALIGNER consisting of: - Model: MA150CC - Automatic Topside & Backside Alignment - Sus Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsCondition Good Year of Manufacture 2010 Year(s) : 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsMANUAL LOAD PROBER AUTOMATICALLY PROBES UP TO A 6″ (150mm) WAFER INCLUDES LOW PROFILE TABLE AND STEREO ZOOM OP Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsthermosonic ball bonder with manual Z lever and heated work holder. Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsmanual wedge bonder with Z lever and U.S. generator. AUTO TUNE ULTRASONIC GENERATOR INCLUDES CALIBRATED STEREO Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsESEC Die Bonder Accessories - Monitors Condition Good Year of Manufacture 2004 Year(s) : 2004 Location : EUROPE (Western and Northern)
Price : On request
More details909 ultrasonic wedge bonder is a simple yet very efficient semi-automatic bonder. It is specifically useful fo Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsManual 2-position Stroke between front and bonding position: 200 mm fixed Dimensions HxWxD (mm): 510x550x600 Location : EUROPE (Western and Northern)
Price : On request
More details60° Bondhead Location : EUROPE (Western and Northern)
Price : On request
More detailsDie Bond Datacon 2200 evo Model:EVO2200:Die Attach Bonder Accessories Power Supply : 230 VAC Power Consumption Year(s) : 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsWire Bonder Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsYou can find used Bonder on Wotol
The main manufacturers of Bonder are Esec, ASM, West Bond, K & S, Kulicke and Soffa (K&S), EVG, Orthodyne, KNS, Westbond, Alphasem, Dage, Delvotec, Mech-El, Hesse, Alessi , Benchmark, Cedal, CMI (Coating Measuring Industries), Datacon, Disco, DNS Dpveen, Dynatex, Ewald Instruments,F&K Delvotec, Hesse & Knipps,Hesse, Hughes, Hybond, HyperVision, Karl Suss, Kulicke and Soffa (K&S) , Laurier, Logitech, MBS, MEI, MRSI, Mullen, OAI, Optima, Palomar, Pesl, Research Device Automation, Research Devices, Royce, SEC, Semiconductor Equipment Corporation (SEC), Shinkawa, Suss, TEL, Tosok, TPT, Tresky, Ultron , Unitek .
The main model 2008HS3 Plus, Eagle Express GOCu , DieSeries, 2100 hS, T-3000-FC3 , Delvotec 5610, Royce 550 Die Bonder, 1204W, A7372E, 7374B, 4523, 1204W, 827, 907Series, 1204B, 829Z, 909Series, 20 Wedge, AD896-06, 2200 EVO, Eagle 60, 2200 APM, 5400B, 7400, 7416, 3100, DINP, 3100, Delvotec, Wedge, LAW-820, DBD3550R, UTC1000, M360C, 850TB,7200A, 520, BT, 572-40, DXB, 505Series, SA220, 4000, 572A, 522, 552A 3000, 703, 709/703, 1WBT5, 850Series, 8000, 3088, 2006S, 3018, 4000HS, CP-222, Swissline, 4020Series, 4450, 7200c, 703/709, 454630E-79, 7400B HBSeries OE, 4000, 360C, 20, 6320, 1WBS2, 990, 20R, 2400PC, 7400A, AD809S Series-4000-P, BJ920 M360C, 8000, UH130, 2200, 2100XP, Leadfrme, 3200, 2100FC, 2008, HS3PLUS, 3088CU, AB339, AD898, 898, 2470-V.
HS Code 8486 90 00 for Die Bonder Machine - Parts and Accessories and other machinery from 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays