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Finetech Fineplacer femto Automated Flip Chip Die Bonder
Ref :
2769818-9-CP
Condition :
Used
Manufacturer :
Finetech
Model :
Fineplacer femto
Short Description :
Automated Flip Chip Die Bonder
Year(s) :
1993
Quantity :
1
Location :
Seller or machines location:
EUROPE (Western and Northern)
EUROPE (Western and Northern)
This Finetech FINEPLACER femto Automated Flip Chip Die Bonder looks to
be in good cosmetic condition.
The system boots up, as shown.
However, I am not sure how to test it, and it is being sold as-is.
Among other things, it features an 8" Temptronic ThermoChuck and Controller,
a Martin Clever-Dispense 05 Dispenser, a Finetech Handler/Dispense Controller,
a Finetech Contact Heating Module, and some Accessories.
Approximate overall unpacked dimensions: 55"L x 76"W x 77"H.
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