Hybond 626 Multipurpose Digital Thermosonic Wire Bonder

Hybond 626 Multipurpose Digital Thermosonic
Wire Bonder, Ball Bonder, Wedge Bonder,
Bump or Stud Bonder, Peg Bonder and more.
Model 626 is a Deep Access, Long Reach Wire Bonder
that can operate as a Ball, Wedge, Bump or Peg bonder.
It can be used for wire diameters from 0.7 to 3.0 mil
(18 to 76μm) gold wire when
in Ball/Bump bonder configuration,
or wire diameters from 0.5 to 3.0 mil (12,7 to 76μm)
and ribbon up to 1.0 x 20.0 mil (25,4 x 510μm)
for Wedge or Peg bonding configuration.
The 626 was specifically designed for applications
that require bonding at extreme height differences between
1st and 2nd bond and for bonding wires
to sensitive devices such as gallium arsenide FET's,
MMICs and LED's.
Model 626's motorized wire feed
and wire/ribbon clamping system provide superior
wire/ribbon control and allow the operator
to increase or decrease tail length in 1 mil (25μm)
increments at a touch of a switch.
The 626 shows actual units for set up of bond parameters.
The change over from Ball bonder
to Wedge bonder requires only a press
of a button to turn EFO power to zero
and a change from capillary to wedge tool.
110V, 50/60Hz.