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Used Wafer Equipment

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AMAT/Varian E500HP (Midcurrentimplant) Wafer Size 150 mm ConditionGood Year of Manufacture1994 Power Requirem Year(s) : 1994 Location : EUROPE (Western and Northern)

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1

VIIsta 3000XP - HE14 - Implanter 300mm The equipment is currently still in warm Steel Type VIIsta 3000XP Wafer Year(s) : 2012 Location : EUROPE (Western and Northern)

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1

scan: KrF Sanner/8in. Location : ASIA (North East)

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1

Stepper Maker SMEE Model SSB320 Location : ASIA (North East)

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Can be sold As Is or can be configured to meet your requirements Batch Wafer Processing Etch/Clean - Wet Proce Year(s) : 2004 Location : EUROPE (Western and Northern)

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Wafer size 12 inch Config FI / MainFrame / Process Chamber(2) / AC Box Location : EUROPE (Western and Northern)

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1

Spares tosell No WaferDiameter 6 Status De-installed Wafer Size Range Minimum 150 mm Maximum 150 mm Set Year(s) : 2007 Location : EUROPE (Western and Northern)

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1

Power: 200VAC 50/60Hz 3 Phase 12" Still in the fab running wafers Year(s) : 2014 Location : EUROPE (Western and Northern)

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1

Process: Grind Planarisierer Wafer Size Range Minimum300 mmMaximum300 mm Condition Very Good Year of Manufactu Year(s) : 2015 Location : EUROPE (Western and Northern)

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1

300mm taiko grinder Three chucks Add on chiller unit /dtu 1531), usv, duct unit, vakuum unit Cassette to Casse Year(s) : 2012 Location : EUROPE (Western and Northern)

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Double Disc Polishing Machine Condition: Completely refurbished Working disc diameter: Ø 1,200 mm Carrier driv Location : EUROPE (Western and Northern)

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Type:NV8250HT Energy Config:0 - 250Kv Midcurrent Build Year:2002 Date of first usage:buyed new from vendor Cu Year(s) : 2002 Location : EUROPE (Western and Northern)

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Wafer Equipment Model ACS-200 Year(s) : 2007 Location : EUROPE (Western and Northern)

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1

Copper CMP CMP Equipment Date of Manufacture: 2006-01-01 Currently Configured for: 300mm Process: CUCMP Tool c Year(s) : 2006 Location : EUROPE (Western and Northern)

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AMAT CENTURA-HART Process: ANISOTROP Procedure: TRENCH Mainframe with 4 chambers. Equipment has Special VITA-C Year(s) : 2002 Location : EUROPE (Western and Northern)

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150mm wafer chuck Windows XP OS 4 micropositioners (N,S,E,W) with camera and illuminator Olympus stereozoom wi Location : AMERICA North (USA-Canada-Mexico)

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Suss PA200DS Blueray dual sided prober for 150 and 200mm wafers SUSS Microtec Proberbench 6 software CD CORE Year(s) : 2007 Location : AMERICA North (USA-Canada-Mexico)

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1

As is. Power-on initial condition Location : EUROPE (Western and Northern)

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1

AMAT E500 Original Equipment Manufacturer? Yes Exact Model Type? E500 EHP Correct maintained?Yes Any damages/d Year(s) : 2016 Location : EUROPE (Western and Northern)

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Thin Wafer handling Hydrogen Implanter, E500 Year of Manufacture 2013 Exterior Dimensions Width 127.559 in (3 Year(s) : 2013 Location : EUROPE (Western and Northern)

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1

KLA-Tencor (Tencor) Surfscan 4500 unpatterned wafer surface inspection tool for automated detection and mappin Location : AMERICA North (USA-Canada-Mexico)

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1

Epi(Si)/6in. Year(s) : 2007 Location : ASIA (North East)

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1

Prober Year(s) : 1995 Location : ASIA (North East)

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1

CVD - TITIN 8'' Completeness: Partial Function: need repair Development_CVD_TiTIN Wafer Size Range Minimum20 Year(s) : 2000 Location : EUROPE (Western and Northern)

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Equipment is under good condition (w/ 3 chambers) Currently inside the cleanroom environment; under idle/warm Year(s) : 2006 Location : EUROPE (Western and Northern)

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You can find used Wafer Equipment on Wotol

The main manufacturers of Wafer Equipment are KLA-Tencor, Karl Suss, Canon, Electroglas, Suss, Nikon, Semitool, TEL, Tokyo Semitsu Kogaku (TSK), Branson / IPC, MGI, Ultron, EVG, Allwin21, Abm, Accretech, ADE, AG Associates, AIO, Alessi, Applied Materials, ASM, ASML, Asyst Technologies, ATMI, Axcelis, Brooks Automation, Buehler, Cambridge, Cascade, Cascade Microtech, CDE (Creative Design Engineering), CEE, CHA, Control Micro Systems (CMS), Cymer, Dainippon Screen,Dektak, Denton, Disco, DNK, DNS, Dynapert, Dynatex, Electroglass, EV Group, Evergreen, Faith, Fluoroware, Fortrend Engineering, Gasonics, GCA, GSI Lumonics, Hitachi, HTG, IMT, InspecTech, Ionic Systems, Jeol, K & S, Kensington, KLA, Kokusai, LAM, Lam Research, Leica, Lintec, Loomis, Lumonics, Mactronix, Matsushita, Mech-El, Micro Automation, MRC, MTI, Nanometrics, Nitto, OAI, Olympus, Oriel, Oxford, Perkin Elmer, PRI, Prometrix, Recif SA, Rucker & Kolls, Suss MicroTec, SVG, Takatori, Tegal, Tencor, Tropel, Ultracision, Ultratech, Ulvac, Veeco, Verteq, Wentworth, Xynetics

The main model  MPASeries, CDS-650CT, PLA-501F, MA-4100, NSR-1505G4, 1000, Titan II, MA150,  6033, 2029,2020,2025, 6200Series, SM200E, Step 200,UM810, UH-130, UF3000 EX, SFX100, M777, FPA-5500iZa, SR8220-019, Desktop 1, 270 SRD, ST-260, 1600-55, 8100XP, 8100Series, 1H-DX, KP-4200, MA-4201Series, MA-1006, L200,UH130M,DFM-M150, CEE 100, SP323, MJB3Series, JWSSeries, MA6Series, SWC4000, EX-5700, 2001X, MDA-60FA, 680A, 8300, ARM200CF, S-5200, S-4700, AS5000, Axiotron II, INS330, Axiospect 301, SF 600, WaferMark II,3308, MASeries, 20T2/150VPO, 860, 1600-55A, UH 102, 4000, Eureka 450, ETI0392A-6-U, 425130, ETII-6910B-X-V, EET1-0395D-X-U, ETII-6910B-X-V, F-6225, 827, 907, 211,UVSeries, AIT8010, eCD2, 8100XPR, CD-SEMSeries, 8250, PC 4400, 300405, SFS 6420, 6D, MM-Cascade 6100, MJB-55, 179884/ P-2 OPEN FRAME, 8300X, 4500, ATRM-2100, SWC11, MAS-8000,ATM-1100E, 3A, 90, RTP-600xp, UKA-650, SPP8, MP 2300, BH-BHM, 2066,AL100-L8, IDLW8R, REL-4500, IDLW8R, MAS-8000, Fix Load25, UKA-825, SCW111, ATRM-2100D, 4055/2, Optistation 3, REL-4500, ResMap 178, 8097, 1600-55m, LSD 100, DSL 10, H100, RHM-06, 908, UH-130, 600W, 100FX, RS 35, P16+, 8620, MA8/BA8 Gen3, lle-855SS, 85DD, SFS7700, 2300 Versys, ZX-1000, Mark7, S-7800HSA, 5610,ES3, M-GAUGE 200, AITI,SFS7200, THERMA-WAVE OP 2600, MA150, 2115, 9400, NGP80, 620, XRF3640, CTR-200, TREX 610, F-4225, EET10395-4-U, SYO-200SS, MS100, RS-75, 7400/18, 2001X 6, PLA-501FA, PS300 Parametric Serie 12, DX-III, SHS 1000VAC, V300-Si, 12", WM650, AlphaStep 300, SURFSCAN 7700, 903eSeries, F6000QS, SP1 TB1, Nanolab 600, NWL860-TMB-SP, F5, DSS200, RS35C, MX-50, DD-823V-8BL, MicroSense 6300, 2400, 4400,E5200, 8108, 600FA, 40, MRC 603, 7700, VersaPort 2200, R-3, SSEC M10, ST-270 SRD, L3510, HTC 8020, Lumonics III, 1800-6AR, HTC 4000, SSW-60A-AR, 1034X, WST 306, ST-860, KIS 2000, L3510E, 9350, PSM 6, 80B, RS-35, DR-8500 II, 301, VLR RIE LM/TM, 20T2/150VPO, 1034 XA – 6, 4085XSeries, 682A, 500R 120-1007, E8025S, 100 RIE, M6000L, EV CS50, 150, RC8, ATM-105-1-S-CE-S293, MPC3000, DMI4000B, 5100, F5x, P-10, LP-200H, F200, CMS1030, CW1002-6200RW, 8860, APM90A, 3001X, APM5000, 880

HS Code 8486 10 10 for Apparatus for rapid heating of semiconductor wafers. 
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devicesde8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices

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