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Used Wafer Equipment

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Double Disc Polishing Machine Condition: Completely refurbished Working disc diameter: Ø 1,200 mm Carrier driv Location : EUROPE (Western and Northern)

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Type:NV8250HT Energy Config:0 - 250Kv Midcurrent Build Year:2002 Date of first usage:buyed new from vendor Cu Year(s) : 2002 Location : EUROPE (Western and Northern)

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Wafer Equipment Model ACS-200 Year(s) : 2007 Location : EUROPE (Western and Northern)

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Copper CMP CMP Equipment Date of Manufacture: 2006-01-01 Currently Configured for: 300mm Process: CUCMP Tool c Year(s) : 2006 Location : EUROPE (Western and Northern)

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AMAT CENTURA-HART Process: ANISOTROP Procedure: TRENCH Mainframe with 4 chambers. Equipment has Special VITA-C Year(s) : 2002 Location : EUROPE (Western and Northern)

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150mm wafer chuck Windows XP OS 4 micropositioners (N,S,E,W) with camera and illuminator Olympus stereozoom wi Location : AMERICA North (USA-Canada-Mexico)

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Suss PA200DS Blueray dual sided prober for 150 and 200mm wafers SUSS Microtec Proberbench 6 software CD CORE Year(s) : 2007 Location : AMERICA North (USA-Canada-Mexico)

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As is. Power-on initial condition Location : EUROPE (Western and Northern)

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AMAT E500 Original Equipment Manufacturer? Yes Exact Model Type? E500 EHP Correct maintained?Yes Any damages/d Year(s) : 2016 Location : EUROPE (Western and Northern)

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Thin Wafer handling Hydrogen Implanter, E500 Year of Manufacture 2013 Exterior Dimensions Width 127.559 in (3 Year(s) : 2013 Location : EUROPE (Western and Northern)

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KLA-Tencor (Tencor) Surfscan 4500 unpatterned wafer surface inspection tool for automated detection and mappin Location : AMERICA North (USA-Canada-Mexico)

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Epi(Si)/6in. Year(s) : 2007 Location : ASIA (North East)

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Prober Year(s) : 1995 Location : ASIA (North East)

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CVD - TITIN 8'' Completeness: Partial Function: need repair Development_CVD_TiTIN Wafer Size Range Minimum20 Year(s) : 2000 Location : EUROPE (Western and Northern)

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Equipment is under good condition (w/ 3 chambers) Currently inside the cleanroom environment; under idle/warm Year(s) : 2006 Location : EUROPE (Western and Northern)

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• Operation: Manual • Maximum Substrate Diameter: 100 mm • Vacuum Chuck Diameter: 4 in • Chuck Type: Vacuum ch Location : AMERICA North (USA-Canada-Mexico)

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AMAT Producer-VME200 8" 3 Chambers, the tool is working and is located in cleanroom Procedure: FCG-TEOSLF Gene Year(s) : 2007 Location : EUROPE (Western and Northern)

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Taper Model DR8500-11 Year(s) : 1999 Location : EUROPE (Western and Northern)

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Programmer 10 programs of up to 10 steps each Custom base cabinet with pull out photoresist cannister tray Max Location : AMERICA North (USA-Canada-Mexico)

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Up to 300mm round or 8" square substrates 0-3000rpm spin range 1-2,000rpm/sec acceleration 300mm wafer centeri Location : AMERICA North (USA-Canada-Mexico)

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KLA-TENCOR ASET-F5x Thin Film Measurement System Manufactured in June, 2002 Inspection Modes Include: Dual Bea Year(s) : 2002 Location : EUROPE (Western and Northern)

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1

KLA Altair 8920i Wafer Frontside Automatic Optical Inspection Tool Combines Brightfield & Darkfield Defect Det Year(s) : 2021 Location : EUROPE (Western and Northern)

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Disco DFL7160 Laser saw (DAF type) The DISCO DFL 7160 is a fully automatic laser saw used in the semiconduct Year(s) : 2014 Location : EUROPE (Western and Northern)

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Disco DTG 8460 Taiko Grinder 12" - 3 Chucks - Add on Chiller (DTU 1531), USV, Duct Unit, Vacuum Unit - Cassett Year(s) : 2012 Location : EUROPE (Western and Northern)

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Tencor surface profile Alpha Step 200 233 good condition , fully working and tested. Location : EUROPE (Western and Northern)

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You can find used Wafer Equipment on Wotol

The main manufacturers of Wafer Equipment are KLA-Tencor, Karl Suss, Canon, Electroglas, Suss, Nikon, Semitool, TEL, Tokyo Semitsu Kogaku (TSK), Branson / IPC, MGI, Ultron, EVG, Allwin21, Abm, Accretech, ADE, AG Associates, AIO, Alessi, Applied Materials, ASM, ASML, Asyst Technologies, ATMI, Axcelis, Brooks Automation, Buehler, Cambridge, Cascade, Cascade Microtech, CDE (Creative Design Engineering), CEE, CHA, Control Micro Systems (CMS), Cymer, Dainippon Screen,Dektak, Denton, Disco, DNK, DNS, Dynapert, Dynatex, Electroglass, EV Group, Evergreen, Faith, Fluoroware, Fortrend Engineering, Gasonics, GCA, GSI Lumonics, Hitachi, HTG, IMT, InspecTech, Ionic Systems, Jeol, K & S, Kensington, KLA, Kokusai, LAM, Lam Research, Leica, Lintec, Loomis, Lumonics, Mactronix, Matsushita, Mech-El, Micro Automation, MRC, MTI, Nanometrics, Nitto, OAI, Olympus, Oriel, Oxford, Perkin Elmer, PRI, Prometrix, Recif SA, Rucker & Kolls, Suss MicroTec, SVG, Takatori, Tegal, Tencor, Tropel, Ultracision, Ultratech, Ulvac, Veeco, Verteq, Wentworth, Xynetics

The main model  MPASeries, CDS-650CT, PLA-501F, MA-4100, NSR-1505G4, 1000, Titan II, MA150,  6033, 2029,2020,2025, 6200Series, SM200E, Step 200,UM810, UH-130, UF3000 EX, SFX100, M777, FPA-5500iZa, SR8220-019, Desktop 1, 270 SRD, ST-260, 1600-55, 8100XP, 8100Series, 1H-DX, KP-4200, MA-4201Series, MA-1006, L200,UH130M,DFM-M150, CEE 100, SP323, MJB3Series, JWSSeries, MA6Series, SWC4000, EX-5700, 2001X, MDA-60FA, 680A, 8300, ARM200CF, S-5200, S-4700, AS5000, Axiotron II, INS330, Axiospect 301, SF 600, WaferMark II,3308, MASeries, 20T2/150VPO, 860, 1600-55A, UH 102, 4000, Eureka 450, ETI0392A-6-U, 425130, ETII-6910B-X-V, EET1-0395D-X-U, ETII-6910B-X-V, F-6225, 827, 907, 211,UVSeries, AIT8010, eCD2, 8100XPR, CD-SEMSeries, 8250, PC 4400, 300405, SFS 6420, 6D, MM-Cascade 6100, MJB-55, 179884/ P-2 OPEN FRAME, 8300X, 4500, ATRM-2100, SWC11, MAS-8000,ATM-1100E, 3A, 90, RTP-600xp, UKA-650, SPP8, MP 2300, BH-BHM, 2066,AL100-L8, IDLW8R, REL-4500, IDLW8R, MAS-8000, Fix Load25, UKA-825, SCW111, ATRM-2100D, 4055/2, Optistation 3, REL-4500, ResMap 178, 8097, 1600-55m, LSD 100, DSL 10, H100, RHM-06, 908, UH-130, 600W, 100FX, RS 35, P16+, 8620, MA8/BA8 Gen3, lle-855SS, 85DD, SFS7700, 2300 Versys, ZX-1000, Mark7, S-7800HSA, 5610,ES3, M-GAUGE 200, AITI,SFS7200, THERMA-WAVE OP 2600, MA150, 2115, 9400, NGP80, 620, XRF3640, CTR-200, TREX 610, F-4225, EET10395-4-U, SYO-200SS, MS100, RS-75, 7400/18, 2001X 6, PLA-501FA, PS300 Parametric Serie 12, DX-III, SHS 1000VAC, V300-Si, 12", WM650, AlphaStep 300, SURFSCAN 7700, 903eSeries, F6000QS, SP1 TB1, Nanolab 600, NWL860-TMB-SP, F5, DSS200, RS35C, MX-50, DD-823V-8BL, MicroSense 6300, 2400, 4400,E5200, 8108, 600FA, 40, MRC 603, 7700, VersaPort 2200, R-3, SSEC M10, ST-270 SRD, L3510, HTC 8020, Lumonics III, 1800-6AR, HTC 4000, SSW-60A-AR, 1034X, WST 306, ST-860, KIS 2000, L3510E, 9350, PSM 6, 80B, RS-35, DR-8500 II, 301, VLR RIE LM/TM, 20T2/150VPO, 1034 XA – 6, 4085XSeries, 682A, 500R 120-1007, E8025S, 100 RIE, M6000L, EV CS50, 150, RC8, ATM-105-1-S-CE-S293, MPC3000, DMI4000B, 5100, F5x, P-10, LP-200H, F200, CMS1030, CW1002-6200RW, 8860, APM90A, 3001X, APM5000, 880

HS Code 8486 10 10 for Apparatus for rapid heating of semiconductor wafers. 
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devicesde8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices

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