KLA-Tencor 2365

Brightfield Wafer Defect Inspection System
Version: 200 mm
Excellent condition
Still in the cleanroom, can be inspected by appointment.

-Currently installed, and in fully operational conditions in the cleanroom.

-This 2365 system has many upgrades, so as the performance is almost the same as 2367 model.

-Dual Open 200 mm wafer cassette loading

-The 2365 UV/visible brightfield inspection system will allow you to see many types of yield-relevant defects down to the 65nm level.
Throughput is much improved, so you can sample more defects which occur during production.
Data rate is increased by 2x over previous generation brightfield tools.
Low false defects and automatic defect classification algorithms reduce time for SEM review and so allow you to do corrective actions quicker.
Buy doing a UV/DUV mix-and-match strategy with another 28xx inspection system maximises efficiency.
Connects with other KLA-Tencor inspectors and review tools optimize inspector capacity; reduce production integration time; and enable faster, more accurate inspection recipe setup on the SEM
Process Window Qualification application enables detection of systematic defects

Typical Uses:
Critical Pattern Layers (≥65nm): High resolution and noise-suppression technologies produce sensitivity to critical patterning defects, including: lithography CD variations and missing contacts; gate etch stringers; STI voids; and copper CMP corrosion.

Photo Cell Monitoring (PCM): Using the 2365 with optimized test wafers, PCM accelerates learning on lithography processes, helping you to quickly find and eliminate lithography-related micro defects.

After-Develop Inspection (ADI): The 2365 minimizes process-induced noise on photo product wafers, enabling the detection of yield-limiting defects, such as poisoned photoresists, micro-bridges, and resist bubbles.

PWQ: The Process Window Qualification (PWQ) application identifies printed reticle design errors, enabling lithographers to qualify the process window for their designs prior to production.