Oxford 100 ICP
AMERICA North (USA-Canada-Mexico)
Max Wafer: 200mm
System Dimensions: 74x34x71
Configuration:
200mm platen, Load-locked single chamber, Chlorine chemistry for metal etch process
- Inductive Coupled Plasma Source (ICP380)
- Chuck size: 8"/200m diameter (8" platen)
- Chuck type: Mechanical Wafer Clamping
- Load-locked single chamber (ICP)
- Alcatel ATH1300M Maglev Turbo Pump
- Alcatel ACT 1300M Controller
- HP Compaq Computer
- LCD Monitor, Keyboard, and Mouse
- Alcatel Adixen ADP 122P Vacuum Pump
- Alcatel 2033 Vacuum Pump
- Firstek B403LS Chiller
- 2 Tempatron TC4800 Temperature Controllers
- EMO Button
- Operations Manual and Documentation
- Offered as Fully Refurbished and Meeting Original Specifications.