Takano WM-10 Surface Particle Inspection System

- Bare wafer surface defect inspection system
- Substrate/Sizes: 2" - 12" Wafer Capable (Chuck and Carrier type dependent)
- Substrate Thickness: Semi Standard +/- 100um
- Handler Options: Single Open Cassette, Dual Open Cassette, Single FOUP, Dual FOUP
- Single or Dual Axis Laser Incident Angle
- Defect Sensitivity: 0.048um on Bare-Si
- Throughput 70 wph Depending on wafer size
- Illumination Source: Laser Diode, approx 405 nm wavelength
- Control PC: Intel Core i7 6700, 6GB Ram, 1TB HDD
- Operating Software: Windows 10 Operating Software
- Software Options Including:
- Auto Sensitivity Calibration
- X-Y Coordinate Output
- Map Overlay
- Haze Measurement
- SECS II Communication