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Used Bonder

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Orthodyne 3600 Plus Wire Bonder - Heavy Ribbon - Z Travel: 50 mm - Theta Travel: +/- 220° - Focus: 30 mm (Prog Location : AMERICA North (USA-Canada-Mexico)

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The machine includes manuals, both sets of clamps, and the video camera option. Location : EUROPE (Western and Northern)

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- Fully programmable microprocessor-controlled epoxy dispensing - Manual X-Y-Z movement, 0.001 in Z-encoder re Location : AMERICA North (USA-Canada-Mexico)

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- Deep-access bond head - 2 in (dia.) heated workholder - West-Bond K1200D temperature controller - West-Bond Location : AMERICA North (USA-Canada-Mexico)

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• Equipment Type: Thin film sputtering system • Deposition Capability: RF magnetron sputtering • Deposition Ca Location : AMERICA North (USA-Canada-Mexico)

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The West Bond 4KE is a semi-automatic wire bonder known for its 3-way convertible design, allowing it to be u Location : AMERICA North (USA-Canada-Mexico)

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Bonder Model FB 880 Year(s) : 2009 Location : EUROPE (Western and Northern)

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Wire bonder Model 7476E Location : EUROPE (Western and Northern)

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This West-bond 7416A Manual Thermocompression Wedge Wire Bonder looks to be in good cosmetic condition, showi Location : EUROPE (Western and Northern)

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Includes: FINEPLACER lambda Bonding force module FD3 Chip heating module Optional Dispensing Module FG3 WinFli Year(s) : 2017 Location : AMERICA North (USA-Canada-Mexico)

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Multi-purpose Die Bonder The FINEPLACER® pico ma is a cost effective bonder designed for prototyping or low- Year(s) : 2021 Location : AMERICA North (USA-Canada-Mexico)

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Digital ball bonder with auto stepback feature Heated workholder Nikon Stereozoom 110VAC/ 220VAC Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

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Bonder sn 14691 Location : AMERICA North (USA-Canada-Mexico)

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Unitek Die bonder 8140-06-06 283 Hybrid Die Bonder . Fitted with heated chuck. Twin cameras and monitors wit Location : EUROPE (Western and Northern)

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Unitek Sie Bonder 8-140 277 Config for epoxy die bond .Semi auto machine with CCTV and monitrs with adjustab Location : EUROPE (Western and Northern)

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PESL Heated stage flip chip bonder DB5/TC designed for the assembly of all types and sizes of semi-conductor d Location : EUROPE (Western and Northern)

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MBS PP200 dIEBONDERS linear air drive for die transport from pickup to placement. Pickup from 4" waffle tray . Location : EUROPE (Western and Northern)

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<b>1x Unitek, 8140-06-06, Die bonder Description</b> Hybrid Die Bonder . Fitted with heated chuck. Twin camer Location : EUROPE (Western and Northern)

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<b>1x Unitek, 8-140, Sie Bonder Description</b> Config for epoxy die bond .Semi auto machine with CCTV and mo Location : EUROPE (Western and Northern)

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Automated Debonding System Location : AMERICA North (USA-Canada-Mexico)

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Automated Production Bonding System Location : AMERICA North (USA-Canada-Mexico)

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Automated Production Bonding System serial number 85080126 Location : AMERICA North (USA-Canada-Mexico)

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Drive System: Dynamic servo drives in X, Y, Z, and P axes Vision System: Datacon image processing system for e Year(s) : 2011 Location : EUROPE (Western and Northern)

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Description: -Tooling for 6" Wafer inclusive Bond Chuck and Pressure Insert -Capable of fusion compression b Year(s) : 2004 Location : EUROPE (Western and Northern)

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DNS Wafer Size 6 Location : ASIA (North East)

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You can find used Bonder on Wotol

The main manufacturers of Bonder are Esec, ASM, West Bond, K & S, Kulicke and Soffa (K&S), EVG, Orthodyne, KNS, Westbond, Alphasem, Dage, Delvotec, Mech-El, Hesse, Alessi , Benchmark, Cedal, CMI (Coating Measuring Industries), Datacon, Disco, DNS Dpveen, Dynatex, Ewald Instruments,F&K Delvotec, Hesse & Knipps,Hesse, Hughes, Hybond, HyperVision, Karl Suss, Kulicke and Soffa (K&S) , Laurier, Logitech, MBS, MEI, MRSI, Mullen, OAI, Optima, Palomar, Pesl, Research Device Automation, Research Devices, Royce, SEC, Semiconductor Equipment Corporation (SEC), Shinkawa, Suss, TEL, Tosok, TPT, Tresky, Ultron , Unitek .

The main model 2008HS3 Plus, Eagle Express GOCu , DieSeries, 2100 hS, T-3000-FC3 , Delvotec 5610, Royce 550 Die Bonder, 1204W, A7372E, 7374B, 4523, 1204W, 827, 907Series, 1204B, 829Z, 909Series, 20 Wedge, AD896-06, 2200 EVO, Eagle 60, 2200 APM, 5400B, 7400, 7416, 3100, DINP, 3100, Delvotec, Wedge, LAW-820, DBD3550R, UTC1000, M360C, 850TB,7200A, 520, BT,  572-40, DXB,  505Series, SA220, 4000, 572A, 522, 552A 3000, 703, 709/703, 1WBT5, 850Series, 8000, 3088, 2006S, 3018, 4000HS, CP-222, Swissline, 4020Series, 4450, 7200c, 703/709, 454630E-79, 7400B HBSeries OE, 4000, 360C, 20, 6320, 1WBS2, 990, 20R, 2400PC, 7400A, AD809S Series-4000-P, BJ920 M360C, 8000, UH130, 2200, 2100XP, Leadfrme, 3200, 2100FC, 2008, HS3PLUS, 3088CU, AB339, AD898, 898, 2470-V.

HS Code 8486 90 00 for Die Bonder Machine - Parts and Accessories and other machinery from 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays

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