KLA-Tencor Shelby LD10

Wafer Size 300 mm
Fab Section Metrology

General Product Information
Vendor Supplier KLA
Model Shelby LD10
Vintage 2014
Asset Description Spectroscopic Thickness Tool
Software Version 6.20.34.11002
CIM SECS
Process Metrology
Hardware Confguration (Fab)
System Type Description Quantity Status
Main System Wafer Thickness (BOW) 1 OK
Main System Stress Measurement 1 OK
Main System iDesorber 1 OK
Main System White Light Refectometry 1 OK
Handler System Phoenix EFEM 2 1 OK
Factory Interface FOUP 3 OK
Main System Broadband Spectroscopic
Ellipsometry 1 OK
Main System Ultraviolet Refectometry 1 OK