EUROPE (Western and Northern)
1. High automatization, the de-soldering, pick-up and placement of chips can be finished by one button, easy operation.
2. Use large power brushless DC fan, closed loop of sensor and micro-computer zero triggering, can generate large volume of hot air. No need for external air supply, easy operation.
3. Seven temperature areas, suitable for reflex BGA, multilayer BGA and metal shielding case.
4. Integrative design, combines heating system and alignment system together.