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Used Semiconductor and PCB Manufacturing

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ID14X14X14″, 208V, 3PH, SOLID STATE PROPORTIONING CONTROLLER, STAINLESS STEEL INTERIOR, 704 DEG C, (1300 F Location : AMERICA North (USA-Canada-Mexico)

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Binocular Angle 45° Eyepieces Magnification 20 X Field Number 13 mm Focusing YES Objective Model Location : AMERICA North (USA-Canada-Mexico)

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Accessories Heated/vacuum work stage 5.25" X 5.75" with model 1201D power supply (see photo #10) Tool heat Location : AMERICA North (USA-Canada-Mexico)

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Binocular Angle 45° Eyepieces Magnification 20 X Focusing YES Magnification Range 18 X - 150 X Zo Location : AMERICA North (USA-Canada-Mexico)

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4 chambers Wafer Size 8,12 Year(s) : 2008 Location : EUROPE (Western and Northern)

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4 chambers Wafer Size 8,12 Year(s) : 2003 Location : EUROPE (Western and Northern)

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【specification】 Seal Character Direction Type: XYZ3-axis simultaneous scanning method Seal Character: YVO4 Las Year(s) : 2014 Location : ASIA (North East)

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【specification】 Target board: Size: W50×L50mm ~ W250×L330mm Thickness 0.6~2.5mm Weight 500g or less Material g Year(s) : 2016 Location : ASIA (North East)

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【specification】 ・Printing laser: Yb: fiber laser class 4 laser Laser wavelength: 1060nm Average output: 25W (p Location : ASIA (North East)

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【specification】 Cleaning tank mouth size: approx. D150 x H150mm [Utility conditions] Compressed air: clean ai Location : ASIA (North East)

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【specification】 Observation method Epi-illumination: bright field, dark field, differential interference obse Location : ASIA (North East)

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Brand Mitaka Kohki Non-contact 3D measuring device 【Main Specifications】 〇Microscope section ・Expensive obser Location : ASIA (North East)

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【specification】 ・Year: 2006 ・Dimensions/weight of drop holding part: W140mm x L140mm x H40mm or less ・1000g or Year(s) : 2006 Location : ASIA (North East)

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【specification】 [Body] ・Vibration direction: Up/down/left/right (2-axis simultaneous vibration) ・Amplitude set Location : ASIA (North East)

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Surface roughness measuring machine Year: Model: 2011 Measurement range/resolution: Z axis 800μm/0.01μm, 80 Year(s) : 2011 Location : ASIA (North East)

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○Main specifications ・Product configuration: Atmospheric pressure plasma unit (Type FPE), plasma irradiation r Year(s) : 2015 Location : ASIA (North East)

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Year: Model: 2015 Tilt mechanism: Yes (X axis, tilt angle ±45 degrees) Measurement range/resolution: X-axis 20 Year(s) : 2015 Location : ASIA (North East)

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Automated Photoresist Coater Version: 200 mm Location : AMERICA North (USA-Canada-Mexico)

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Equipped with Magnum ion Column SFEG UHR SEM STEM capable! 5 axis stage with 100 x 100 mm XY Turbo vacuum 2 GI Location : AMERICA North (USA-Canada-Mexico)

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Pfeiffer/Balzers Turbo Pump TPU 060 with TPC121 Turbo Pump TPU060 DN 63 CF Turbo Pump Controller TPC121 Band Location : AMERICA North (USA-Canada-Mexico)

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CTI-Cryogenics 8032211 Model SCW Compressor Location : AMERICA North (USA-Canada-Mexico)

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CTI Cryogenics 8033167 Cryo-Torr 8 Cryopump Location : AMERICA North (USA-Canada-Mexico)

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Alcatel 5080 Turbo Vacuum Pump with CFF 100 Controller Location : AMERICA North (USA-Canada-Mexico)

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Alcatel R601B / 2063+ Roughing Pump - Unit has some fomblin oil in it. - Voltage is 230/460 wired for low vo Location : AMERICA North (USA-Canada-Mexico)

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Leybold TurboVac 150V 4" Turbo Pump Catalog - Pump inlet is a 6" conflat flange - Oil sump is not filled with Location : AMERICA North (USA-Canada-Mexico)

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Used Semiconductor and PCB Manufacturing for sale

You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).

Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.

Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.

This industry is largely located in Asia and expecially in China.

The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES) 

The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14

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