Used Semiconductor and PCB Manufacturing
9,176 resultsPVA TEPLA 660 Microwave Plasma Cleaning System. Low-pressure microwave plasma systems for cleaning advanced Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsPVA TEPLA ION 100 Plasma Treatment System. Features Include: Plug and play self installation Flexible electr Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsCan be used for thickness test of plastic films, sheets, paper, foils, silicon chip, coatings and other mater Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Particle Size Range: 0.5 to 10 microns • Manifold: AM-12-1.0 aerosol manifold • Pump: AM-12 pump included • Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Temperature Range: -90°C to +225°C • Transition Rate (-55°C to +125°C): <10 seconds • Transition Rate (+125° Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Application: Cutting and shearing for soft to medium-hard, fibrous, tough materials • Max. feed size: 120 x Location : AMERICA North (USA-Canada-Mexico)
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More details• Process: PVD physical vapor deposition • Bell jar diameter: 19 in., water cooled • Fixturing: Triple dome pl Location : AMERICA North (USA-Canada-Mexico)
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More detailsTESCAN VEGA-II Model LSH SEM. Computer Controlled Scanning Electron Microscope, high vacuum operation, 230mm Location : AMERICA North (USA-Canada-Mexico)
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More detailsK&S 4524AD Programmable Digital Ball Bonder. Manages 200 programs with up to six channels per program. Motor Location : AMERICA North (USA-Canada-Mexico)
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More detailsSSEC 3302 Single Wafer Chemical Etch Processor. Two wafer processing modules, acid processing. Stainless ste Location : AMERICA North (USA-Canada-Mexico)
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More detailsWest Bond 4KEX Semi-Automatic, Motorized Y/Z Axes, Wedge-Wedge, Ball-Wedge Convertible Large Substrate Wire B Location : AMERICA North (USA-Canada-Mexico)
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More detailsEVG 520 WAFER BONDER consisting of: - Model: EVG 520 - Manual wafer load substrate bonder - Capable of fusion Location : AMERICA North (USA-Canada-Mexico)
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More detailsFunction: Loads PCBs onto production line from magazines or stacks Use: Simplifies double-sided board assembly Location : AMERICA North (USA-Canada-Mexico)
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More detailsFinal Specifications – Your Configuration Dimensions & Weight Machine size (L × W × H): 3,540 × 1,455 × 1,665 Location : EUROPE (Western and Northern)
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More detailsA robust, mid-to-high volume SMT reflow soldering system designed for efficient and precise PCB assembly, sup Location : EUROPE (Western and Northern)
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More detailsProvides the High Yields and Excellent Repeatability Needed for All Gold Ball Bonding Applications Including: Location : AMERICA North (USA-Canada-Mexico)
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More detailsPlasmatherm SLR-720/720 Dual Chamber RIE Reactive Ion Etch System. PC controller with graphical user interfac Location : AMERICA North (USA-Canada-Mexico)
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More detailsPlacement Speed: Rated up to ~14,000 CPH (Topaz‑X) Head Configuration: Single beam with 4 “flying nozzle chan Location : EUROPE (Western and Northern)
Price : On request
More detailsHeads 8 Super‑Fine Throughput ~11.6k CPH (4‑head), ~17.7k CPH (8‑head) Placement accuracy (3σ) 40–50 µm Feeder Year(s) : 2006, 2008 Location : EUROPE (Western and Northern)
Price : On request
More detailsTechnical Specifications (approx.): Max PCB Size: ~20 x 20 inches (508 x 508 mm) Alignment Accuracy: ±12.5 µm Location : EUROPE (Western and Northern)
Price : On request
More detailsK&S 4524D Programmable Digital Ball Bonder. Manages 200 programs with up to six channels per program. Digita Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWest Bond 353637E-90 Automatic, Gantry, Large Area, Triple-Convertible Wire Bonder. Currently configured for Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Resolution: 3 nm at 30 kV • Magnification: Up to 300,000× • Stage: 5-axis motorized • Sample Size: Supports Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details• Wafer Size: 200 mm • Chuck Type: Temperature controlled (no chiller or controller included) • Microscope: Mi Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsReflow Oven Model Pyramax 98N Location : EUROPE (Western and Northern)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14