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Used Wafer Equipment

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1

Trikon/SPTS PVD Tool Wafer Size Range Minimum 200 mm Maximum 200 mm Set Size 200 mm Accessories Year(s) : 1999 Location : EUROPE (Western and Northern)

Price : On request

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Wafer size: 12 Turbo pump- Alcatel ATH 1600M Bias RF (13.5 MHz)- Daihen RMN-50N1 LF Bias RF (2 MHz) -Daihen R Year(s) : 2007 Location : EUROPE (Western and Northern)

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8" Condition: Good- SOG etch - 4ch MxP+ Year(s) : 2007 Location : EUROPE (Western and Northern)

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Process: poly CMP Manufacturer: Novellus Systems Good condition Year(s) : 2011 Location : EUROPE (Western and Northern)

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trans: Wafer Management System Location : ASIA (North East)

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1

Wafer Stepper Year(s) : 2017 Location : EUROPE (Western and Northern)

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1

OEM Group 470S SRD High Performance Spin Rinse Dryer Wafer Cleaner. The SRD is a 25 wafer, batch size, single Location : AMERICA North (USA-Canada-Mexico)

Price : On request

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Steag (AG Associates) Heatpulse 610 RTP Rapid Thermal Processing System. Manually loaded and capable of proce Location : AMERICA North (USA-Canada-Mexico)

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Semitool STI 870 Spin Rinser Dryer Double Stack. 6” Wafer Rotor in the top spinner and a 4" Rotor in the bott Location : AMERICA North (USA-Canada-Mexico)

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SUSS MICROTEC MJB3 MASK ALIGNER consisting of: - Model: MJB3 Main System - Manufacturer: Suss MicroTec Location : AMERICA North (USA-Canada-Mexico)

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Wafer weighing system - Filmthickness Wafer Size Range Set Size 200 mm Accessories Wafer Scale (Mettle Year(s) : 2011 Location : EUROPE (Western and Northern)

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Wafer weighing system - Filmthickness Wafer Size Range Minimum 200 mm Maximum 300 mm Other Informatio Year(s) : 2017 Location : EUROPE (Western and Northern)

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Wafer weighing system - Filmthickness Wafer Size Range Set Size 200 mm Accessories Last Calibration of W Year(s) : 2015 Location : EUROPE (Western and Northern)

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3

Grinder Heavy smoker DTU 150 Chiller DVC 010 Vacuum coolant unit Air supply source: Pressure: 0.5-0.8 MPa Location : ASIA (South East)

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good condition Location : EUROPE (Western and Northern)

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1

Nitto De-Taper, sold in working condition Year(s) : 1999 Location : EUROPE (Western and Northern)

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• Wafer Size Capability: 5 – 8 inch • Version: 150 mm • Beam Energy: Up to 200 keV • Dose Range: 1×10¹⁰ – 1×10 Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

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Cleaner/Wafer Year(s) : 2005 Location : ASIA (North East)

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• Wafer Size: 200 mm • Chuck Type: Temperature controlled (no chiller or controller included) • Microscope: Mi Location : AMERICA North (USA-Canada-Mexico)

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KLA-Tencor UV 1280 SE Film Thickness Measurement Tool 6", 8" 2001 Vintage Year(s) : 2001 Location : EUROPE (Western and Northern)

Price : On request

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• Type: Spin Rinser Dryer • Application: Cleaning, rinsing, and drying for wafer cassettes • Wafer Batch: 25 w Location : AMERICA North (USA-Canada-Mexico)

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• Type: Rapid Thermal Processing System • Wafer Sizes: Small pieces, 2", 3", 4", 5", 6", 8" (currently configu Year(s) : 2021 Location : AMERICA North (USA-Canada-Mexico)

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• Type: Manual probe station • Optics: B&L stereo zoom 4 • Optional upgrade: Zoom 5 (+$100), Zoom 7 (+$400) • Location : AMERICA North (USA-Canada-Mexico)

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• Wafer size: 4″ • Optics: Mitutoyo high-power microscope with Microzoom optics • Objectives: 2 included • Chu Location : AMERICA North (USA-Canada-Mexico)

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Canon FPA- 5500iZ+ Wafer Size Range Minimum 300 mm Maximum 300 mm Set Size 300 mm Other Information Year(s) : 2004 Location : EUROPE (Western and Northern)

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You can find used Wafer Equipment on Wotol

The main manufacturers of Wafer Equipment are KLA-Tencor, Karl Suss, Canon, Electroglas, Suss, Nikon, Semitool, TEL, Tokyo Semitsu Kogaku (TSK), Branson / IPC, MGI, Ultron, EVG, Allwin21, Abm, Accretech, ADE, AG Associates, AIO, Alessi, Applied Materials, ASM, ASML, Asyst Technologies, ATMI, Axcelis, Brooks Automation, Buehler, Cambridge, Cascade, Cascade Microtech, CDE (Creative Design Engineering), CEE, CHA, Control Micro Systems (CMS), Cymer, Dainippon Screen,Dektak, Denton, Disco, DNK, DNS, Dynapert, Dynatex, Electroglass, EV Group, Evergreen, Faith, Fluoroware, Fortrend Engineering, Gasonics, GCA, GSI Lumonics, Hitachi, HTG, IMT, InspecTech, Ionic Systems, Jeol, K & S, Kensington, KLA, Kokusai, LAM, Lam Research, Leica, Lintec, Loomis, Lumonics, Mactronix, Matsushita, Mech-El, Micro Automation, MRC, MTI, Nanometrics, Nitto, OAI, Olympus, Oriel, Oxford, Perkin Elmer, PRI, Prometrix, Recif SA, Rucker & Kolls, Suss MicroTec, SVG, Takatori, Tegal, Tencor, Tropel, Ultracision, Ultratech, Ulvac, Veeco, Verteq, Wentworth, Xynetics

The main model  MPASeries, CDS-650CT, PLA-501F, MA-4100, NSR-1505G4, 1000, Titan II, MA150,  6033, 2029,2020,2025, 6200Series, SM200E, Step 200,UM810, UH-130, UF3000 EX, SFX100, M777, FPA-5500iZa, SR8220-019, Desktop 1, 270 SRD, ST-260, 1600-55, 8100XP, 8100Series, 1H-DX, KP-4200, MA-4201Series, MA-1006, L200,UH130M,DFM-M150, CEE 100, SP323, MJB3Series, JWSSeries, MA6Series, SWC4000, EX-5700, 2001X, MDA-60FA, 680A, 8300, ARM200CF, S-5200, S-4700, AS5000, Axiotron II, INS330, Axiospect 301, SF 600, WaferMark II,3308, MASeries, 20T2/150VPO, 860, 1600-55A, UH 102, 4000, Eureka 450, ETI0392A-6-U, 425130, ETII-6910B-X-V, EET1-0395D-X-U, ETII-6910B-X-V, F-6225, 827, 907, 211,UVSeries, AIT8010, eCD2, 8100XPR, CD-SEMSeries, 8250, PC 4400, 300405, SFS 6420, 6D, MM-Cascade 6100, MJB-55, 179884/ P-2 OPEN FRAME, 8300X, 4500, ATRM-2100, SWC11, MAS-8000,ATM-1100E, 3A, 90, RTP-600xp, UKA-650, SPP8, MP 2300, BH-BHM, 2066,AL100-L8, IDLW8R, REL-4500, IDLW8R, MAS-8000, Fix Load25, UKA-825, SCW111, ATRM-2100D, 4055/2, Optistation 3, REL-4500, ResMap 178, 8097, 1600-55m, LSD 100, DSL 10, H100, RHM-06, 908, UH-130, 600W, 100FX, RS 35, P16+, 8620, MA8/BA8 Gen3, lle-855SS, 85DD, SFS7700, 2300 Versys, ZX-1000, Mark7, S-7800HSA, 5610,ES3, M-GAUGE 200, AITI,SFS7200, THERMA-WAVE OP 2600, MA150, 2115, 9400, NGP80, 620, XRF3640, CTR-200, TREX 610, F-4225, EET10395-4-U, SYO-200SS, MS100, RS-75, 7400/18, 2001X 6, PLA-501FA, PS300 Parametric Serie 12, DX-III, SHS 1000VAC, V300-Si, 12", WM650, AlphaStep 300, SURFSCAN 7700, 903eSeries, F6000QS, SP1 TB1, Nanolab 600, NWL860-TMB-SP, F5, DSS200, RS35C, MX-50, DD-823V-8BL, MicroSense 6300, 2400, 4400,E5200, 8108, 600FA, 40, MRC 603, 7700, VersaPort 2200, R-3, SSEC M10, ST-270 SRD, L3510, HTC 8020, Lumonics III, 1800-6AR, HTC 4000, SSW-60A-AR, 1034X, WST 306, ST-860, KIS 2000, L3510E, 9350, PSM 6, 80B, RS-35, DR-8500 II, 301, VLR RIE LM/TM, 20T2/150VPO, 1034 XA – 6, 4085XSeries, 682A, 500R 120-1007, E8025S, 100 RIE, M6000L, EV CS50, 150, RC8, ATM-105-1-S-CE-S293, MPC3000, DMI4000B, 5100, F5x, P-10, LP-200H, F200, CMS1030, CW1002-6200RW, 8860, APM90A, 3001X, APM5000, 880

HS Code 8486 10 10 for Apparatus for rapid heating of semiconductor wafers. 
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devicesde8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices

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